Effects of combined thermal and vibration loadings on the wire bond integrity

Kamaludin, K. A.; Mirgkizoudi, Maria; Liu, C.; Riches, Steve

doi:10.1109/icept.2011.6066958

Cited by 2 publications

(3 citation statements)

References 4 publications

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“…As reported previously [6], [7], [8], the orientation of the wires in respect to the axis of the vibration, results in different failure modes.…”

Section: Mechanical Deformation Of Bonded Wires Due To High Temperatumentioning

confidence: 77%

“…Therefore, the combined tests replicated three times i.e. one time for each of the equipment's orthogonal 7 axes. The duration of each test was 3 hours (one hour per axis).…”

Section: Combined High Temperature With Vibration Test Profilementioning

confidence: 99%

“…The interfacial failure at the wire-bonds, and subsequently lift-offs was found mostly on the interconnections with the substrate. Our previous work [7] on the behaviour of the wire-bonded devices with respect to the direction of the vibration has also indicated that the distortion and subsequent failure is more severe when the wires are vertically oriented to the direction of the vibration. Failure modes such as wire lift-offs and short circuits occurred more often in such a case.…”

Section: Introductionmentioning

confidence: 99%

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Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions

Mirgkizoudi

Liu

Conway

et al. 2015

Microelectronics Reliability

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This paper concerns the reliability of thermosonically bonded 25µm Au wires in the combined high temperature with vibration conditions, under which the tests have been carried out on wire bonded 40-pin Dual-in-Line (DIL) High Temperature Co-fired Ceramic (HTCC) electronic packages. Mechanical, optical and electrical analysis has been undertaken in order to identify the failure mechanisms of bonded wires due to the combined testing. The results indicated a decrease in the electrical resistance after a few hours of testing as a result of the annealing process of the Au wire during testing. Shear and pull strength levels remained high in general after testing, showing no significant deterioration due to the test under the combined high temperature and vibration conditions. However, a trend of the variation in the strength values is identified with respect to the combined conditions for all wire bonded packages, which may be summarised as: i) increase of the testing temperature has led to a decrease of both the shear and pull strength of the wire bonds; ii) the mechanical behaviour of the wires is affected due to crystallization that leads to material softening and consequently the deformation of wire. to identify the failure mechanisms of bonded wires due to the combined testing. The results indicated a decrease in the electrical resistance after a few hours of testing as a result of the annealing process of the Au wire during testing. In general, ball shear and wire pull strength levels remained high after testing, showing no significant deterioration due to the tests under the combined high temperature and vibration conditions. However, a trend of the variation in the strength values is identified with respect to the combined conditions for all wire-bonded packages, which may be summarised as: i) increase of the testing temperature has led to a decrease of both the shear and pull strength of the wire bonds; ii) the mechanical behaviour of the wires is affected due to crystallization that leads to material softening and consequently the deformation of wire.

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“…As reported previously [6], [7], [8], the orientation of the wires in respect to the axis of the vibration, results in different failure modes.…”

Section: Mechanical Deformation Of Bonded Wires Due To High Temperatumentioning

confidence: 77%

“…Therefore, the combined tests replicated three times i.e. one time for each of the equipment's orthogonal 7 axes. The duration of each test was 3 hours (one hour per axis).…”

Section: Combined High Temperature With Vibration Test Profilementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions

Mirgkizoudi

Liu

Conway

et al. 2015

Microelectronics Reliability

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Modeling of Thermomechanical Behaviour of Wire Bonded Electronic Devices under Combined Thermal and Vibration Loads

Man

Liu

Mirgkizoudi

et al. 2014

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)

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This paper has extended the investigation of the combined effects of thermal and vibration loadings by numerical and finite element analysis (FEA) of the stresses and strains in Au ball-wedge wire bonded devices. A comparison with Cu and Al wires was also performed. The finite element model was established in order to predict the stresses and strains induced in the bond wires by analysing the thermal coefficient of expansion which is affected by temperature, excitation frequency of the bond wires during vibration and the subsequent changes from different wire bonding profiles. The effect of combined loading was found to increase the stresses by decreasing the resonant frequency that the wire experiences. The material seems to have a more significant effect in increasing the stresses than the loop height of wire bonds. The work has demonstrated the usefulness of numerical methods to permit the reasonable predictions of the complex mechanical behaviour of wire bond under the combined high temperature and vibration testing regimes.

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Effects of combined thermal and vibration loadings on the wire bond integrity

Cited by 2 publications

References 4 publications

Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions

Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions

Modeling of Thermomechanical Behaviour of Wire Bonded Electronic Devices under Combined Thermal and Vibration Loads

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