Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions

Abstract

This paper concerns the reliability of thermosonically bonded 25µm Au wires in the combined high temperature with vibration conditions, under which the tests have been carried out on wire bonded 40-pin Dual-in-Line (DIL) High Temperature Co-fired Ceramic (HTCC) electronic packages. Mechanical, optical and electrical analysis has been undertaken in order to identify the failure mechanisms of bonded wires due to the combined testing. The results indicated a decrease in the electrical resistance after a few hours of testing as a result of the annealing process of the Au wire during testing. Shear and pull strength levels remained high in general after testing, showing no significant deterioration due to the test under the combined high temperature and vibration conditions. However, a trend of the variation in the strength values is identified with respect to the combined conditions for all wire bonded packages, which may be summarised as: i) increase of the testing temperature has led to a decrease of both the shear and pull strength of the wire bonds; ii) the mechanical behaviour of the wires is affected due to crystallization that leads to material softening and consequently the deformation of wire. to identify the failure mechanisms of bonded wires due to the combined testing. The results indicated a decrease in the electrical resistance after a few hours of testing as a result of the annealing process of the Au wire during testing. In general, ball shear and wire pull strength levels remained high after testing, showing no significant deterioration due to the tests under the combined high temperature and vibration conditions. However, a trend of the variation in the strength values is identified with respect to the combined conditions for all wire-bonded packages, which may be summarised as: i) increase of the testing temperature has led to a decrease of both the shear and pull strength of the wire bonds; ii) the mechanical behaviour of the wires is affected due to crystallization that leads to material softening and consequently the deformation of wire.

Comparison Study of Time Domain Reflectometry (TDR) Measurement Methods for Detecting Wire Interconnect Related Open-Contact and Short-Contact Failures in Power Semiconductor

“…The open-contact failure can be due to non-stick on lead (NSOL), non-stick on pad (NSOP) or broken wire [8,9]. The short-contact failure can be due to sagging wire, distorted wire or wire sweep [10][11][12], that lead to the wire contacts with either the adjacent wire or lead post. Those devices with open or short-contact failures including those failing electrical test are sorting out from the good devices at the final electrical testing of power semiconductor [13][14][15].…”