Effects of curing accelerators on physical properties of epoxy molding compound (EMC)

Ogata, Masatsugu; Kinjo, Noriyuki; Eguchi, S.; Hozoji, Hiroshi; Kawata, Tatsuo; Sashima, Hiroki

doi:10.1002/app.1992.070441012

Cited by 27 publications

(13 citation statements)

References 22 publications

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“…Results of epoxy resins cured by PH-C and Ph-D show the same trend. This confirms the relationship between crosslinking density and physical properties observed by Ogata et al from epoxy molding compound [9]. They showed that the crosslinking density is related to the free volume in the cured epoxy resins and is the most dominant factor that determines various physical properties of the resins.…”

Section: Thermo-mechanical Properties Of Cured Underfillssupporting

confidence: 79%

Development of environmentally friendly nonanhydride no-flow underfills

Zhang

Fan

Wong

2002

IEEE Trans. Comp. Packag. Technol.

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Most no-flow underfill materials are based on epoxy/anhydride chemistry. Due to the sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using nonanhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in terms of their curing behavior, thermo-mechanical properties, viscosity, adhesion toward passivation, moisture absorption and the reliability in flip-chip underfill package. The influence of chemical structure and the crosslinking density of the resin on the material properties is investigated.The assembly with nonanhydride underfill shows high reliability from the thermal shock test. Solder wetting test has confirmed the sufficient fluxing capability of phenolic resins. Results show that epoxy/phenolic system has great potential for an environmental friendly and highly reliable no-flow underfill.Index Terms-Epoxy/phenolic resin, fluxing capability, material properties, no-flow underfill, thermal shock test.

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Section: Thermo-mechanical Properties Of Cured Underfillssupporting

confidence: 79%

Development of environmentally friendly nonanhydride no-flow underfills

Zhang

Fan

Wong

2002

IEEE Trans. Comp. Packag. Technol.

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“…It is considered that enough space is needed for the small segment of polymer chains to become movable at the glass transition temperature and the expansion of space becomes 1. 4 times that of volume at room temperature for these epoxy compounds. Epoxy compounds consisting of THPM have a low moisture resistance compared with other novolac epoxy compounds and this is consistent with the fact that the hole volume determined by 73 is larger than those of the others.…”

Section: Resultsmentioning

confidence: 98%

Novolac epoxy resins and positron annihilation

Suzuki

Oki

Numajiri

et al. 1993

J of Applied Polymer Sci

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SYNOPSISFour kinds of epoxy resins: cresol novolac, tris-hydroxyphenylmethane, tetramethylbiphenol, and bisphenol A, were cured with phenol novolac epoxy resins. Characteristics of these epoxy compounds were studied by the positron annihilation lifetime (PAL) technique. Glass transition temperatures, thermal expansion coefficients, and volume of intermolecularspace holes among polymer chains were obtained from the lifetime, T~, of the long-lived component of ortho-positronium. It was revealed that, at the glass transition temperature, Tg, the volume of the hole created among polymer chains expanded 1.4 times the volume at room temperature. The smaller flexural modulus of tris-hydroxyphenylmethane than that of the other samples was explained by the volume of intermolecular-space holes obtained from T~. Aging effects were seen in the data of the intensities, Z3, of ortho-positronium, which became smaller after heating the samples above T g . I3 and 7 3 were strongly affected by the density of cross-linkings and their chemical structures. The larger the density of cross-linkings, the smaller I3 and higher Tg were obtained. Epoxy compounds with the higher water-absorption rates had larger intermolecular-space holes. 0 1993 John Wiley & Sons. Inc.

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“…To improve the solder joint reliability, underfill is used between the chip and the substrate. The properties of underfill materials, such as curing behavior, CTE, Tg, storage modulus (G) and viscosity (η), are of great interest since they are crucial to the package reliability [1]. Typical commercially available underfill materials consist of an epoxy system that includes curing agent, catalysts, fillers such as SiO 2 , and additives.…”

Section: Introductionmentioning

confidence: 99%

Comparative study of anhydride and amine-based underfill materials for flip chip applications

Zhu

Zhang

et al. 2016

2016 China Semiconductor Technology International Conference (CSTIC)

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Anhydride and amine epoxy systems are widely used as hardeners in underfill materials for flip chip packaging. A comparison was made between these two systems in order to evaluate the comprehensive performance of the resulting underfill. It was found that the addition of multi-size silica particles has little effect on the curing reaction of the epoxy mixture while a significant effect on increasing the viscosity, storage modulus, Tg and lowering the CTE and the magnitude of the tanδ peak with the increase of SiO 2 loading for both anhydride and amine curing system. Moreover, with the same filler loading, compared with the amine based underfill, the anhydride system exhibited much lower viscosity, glassy modulus, and CTE in the glassy region and lower Tg thus showing a potential for flip chip underfilling applications.

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Effects of curing accelerators on physical properties of epoxy molding compound (EMC)

Cited by 27 publications

References 22 publications

Development of environmentally friendly nonanhydride no-flow underfills

Development of environmentally friendly nonanhydride no-flow underfills

Novolac epoxy resins and positron annihilation

Comparative study of anhydride and amine-based underfill materials for flip chip applications

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