Effects of cutting parameters on the subsurface damage of single crystal copper during nanocutting process

Zhang, Ping; Cao, Xian Long; Zhang, Xiancheng; Wang, Youqiang

doi:10.1016/j.vacuum.2020.109420

Cited by 27 publications

(7 citation statements)

References 22 publications

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“…In this article, all simulations were performed using the open-source parallel MD code LAMMPS, which has been used to simulate the radiation damage of materials [ 32 , 33 , 34 ]. The results were analyzed using the visualization software OVITO [ 35 , 36 , 37 ]. At room temperature, GaN consistently exhibits the crystal structure of wurtzite, which is a hexagonal crystal system.…”

Section: Simulation Methodsmentioning

confidence: 99%

Molecular Dynamics Study on the Mechanism of Gallium Nitride Radiation Damage by Alpha Particles

2023

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In special applications in nuclear reactors and deep space environments, gallium nitride detectors are subject to irradiation by α-particles. Therefore, this work aims to explore the mechanism of the property change of GaN material, which is closely related to the application of semiconductor materials in detectors. This study applied molecular dynamics methods to the displacement damage of GaN under α-particle irradiation. A single α-particle-induced cascade collision at two incident energies (0.1 and 0.5 MeV) and multiple α-particle injections (by five and ten incident α-particles with injection doses of 2 × 1012 and 4 × 1012 ions/cm2, respectively) at room temperature (300 K) were simulated by LAMMPS code. The results show that the recombination efficiency of the material is about 32% under 0.1 MeV, and most of the defect clusters are located within 125 Å, while the recombination efficiency of 0.5 MeV is about 26%, and most of the defect clusters are outside 125 Å. However, under multiple α-particle injections, the material structure changes, the amorphous regions become larger and more numerous, the proportion of amorphous area is about 27.3% to 31.9%, while the material’s self-repair ability is mostly exhausted.

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Section: Simulation Methodsmentioning

confidence: 99%

Molecular Dynamics Study on the Mechanism of Gallium Nitride Radiation Damage by Alpha Particles

2023

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“…(2021) used a self-developed ceramic micro milling cutter to examine the micro machinability of 2024 aluminum alloy, considering the machining channel burrs, dimensional accuracy, tool wear, and chip geometry under different cutting parameters (Kuramoto et al., 2014; Zargar et al., 2012; Zhang et al., 2020). They discovered that optimized cutting parameters not only create grooves with good quality, high dimensional accuracy and minimal burrs (Jiang et al., 2022; Zhang et al., 2021), after 10–20 min micro milling, the tool also has low wear and good chip-breaking ability.…”

Section: Introductionmentioning

confidence: 99%

Effect of cutting parameters on the microstructure evolution and damage mechanism of 7075-T6 aluminum alloy in micro cutting

Zhang

Lin

Liu

et al. 2023

International Journal of Damage Mechanics

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This work aims to explore how cutting parameters affect the microstructure evolution and damage mechanism of 7075-T6 aluminum alloy in micro cutting. The effect of cutting parameters on micro cutting force and surface morphology is examined through single-factor test. By building a 3D micro finite element model for micro cutting based on crystal plasticity theory, the effect of cutting parameters on residual stress, microstructure evolution and damage behavior is analyzed to establish a mapping relation between residual stress and damage. The results show that as cutting speed increases, main cutting force first reduces then increases in all cases, but the cutting speed at the inflection point corresponding to main cutting force is different. The micro cutting surface morphology of 7075-T6 aluminum alloy displays obvious signs of plowing; detectable oxidation adhesion wear appears when the cutting depth is greater than 150 μm. Crack initiation and propagation on the machined surface of 7075-T6 aluminum alloy vary considerably under different cutting parameters. Residual stress distribution displays a ladle profile. The deeper the maximum residual compressive stress is from the surface, the harder it is for micro cracks to initiate and propagate. SEM and EDS analysis indicates that at smaller cutting depths, micro cutting tool wear is dominated by oxidation wear; at larger cutting depths, surface morphology is mostly better than at smaller cutting depths.

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“…Results reveal that in addition to cutting parameters (e.g., cutting speed [4] and cutting depth [5]), tool geometry [6,7], loading modes [8,9], and anisotropy [10,11] also have considerable efects on the material removal mechanism and subsurface defects of monocrystalline Cu. Zhang et al [12] studied the efect of cutting depth and cutting speed on the dislocation nucleation within the subsurface by MDs, and it was found that the increase in cutting speed and cutting depth contributed to the formation of the stair-rod dislocation and Hirth dislocation. Zhu et al [13] adopted the fnite element method to simulate a nanoscratching process of monocrystalline Cu.…”

Section: Introductionmentioning

confidence: 99%

Material Removal Mechanism and Evolution of Subsurface Defects during Nanocutting of Monocrystalline Cu

Liu,

Wang,

Yang

2023

Nanomaterials and Nanotechnology

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Multigroup large-scalenanocutting models of monocrystalline Cu were established by molecular dynamics simulations to investigate the influence of cutting parameters on the material removal mechanism. The formation and distribution of subsurface defect structures were revealed, and the evolution behavior of the complete prismatic dislocation loop was analyzed in depth. It was demonstrated that the chips and machined surface of monocrystalline Cu were mainly formed under the coupling effect of shearing and extrusion forces. A diamond tool with a larger edge radius or a negative rake angle could produce a noticeable suppression on the chip formation. The corresponding relationship between the location of defect atoms and the distribution of von Mises stress was studied, which indicated that the shear stress would become larger at the subgrain boundaries, dislocation lines, and the amorphous atoms than that in their nearby regions. The complete prismatic dislocation loop was formed by cross-slip between two sets of stacking faults; meanwhile, the generated multiple Lomer–Cottrell locks hindered its movement and promoted the work-hardening phenomenon. These research results are of great theoretical value to enrich the nanocutting mechanism and technology of plastic materials.

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Effects of cutting parameters on the subsurface damage of single crystal copper during nanocutting process

Cited by 27 publications

References 22 publications

Molecular Dynamics Study on the Mechanism of Gallium Nitride Radiation Damage by Alpha Particles

Molecular Dynamics Study on the Mechanism of Gallium Nitride Radiation Damage by Alpha Particles

Effect of cutting parameters on the microstructure evolution and damage mechanism of 7075-T6 aluminum alloy in micro cutting

Material Removal Mechanism and Evolution of Subsurface Defects during Nanocutting of Monocrystalline Cu

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