Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

“…A large number of research and review papers described the impact of dopants on the microstructure and physical properties of SAC solders in the liquid and/or solid state [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20]. It was shown that minor insertions of additional elements modify the microstructure and improve different properties of SAC alloys.…”

Effect on the wettability, hardness and shear strength properties of 3%-nano Titanium Oxide (TiO2) added Sn-3.8Ag-0.7Cu (SAC)/Copper (Cu) solder joint

“…Additions of nanoparticles will slightly increase the viscosity of the solder alloy that increases the contact angle. It is a typical characteristics of the nanoparticles to move to the leading edge of the molten solder during soldering, as they do not take part in the diffusion process [25], and at an instant of 250°C of soldering temperature, the heat would have no influence to melt the TiO 2 (T M = 1843°C). This was similarly reported by [26].…”

“…There was a clear increase in the hardness values of the SAC + 3% TiO 2 solder alloy. Firstly, the increase is due to the nanoparticles in the solder alloy acting as site for heterogeneous nucleation because they do not take part in the diffusion process [25,29]. This will increases the eutectic area of the solder alloy, and eutectic areas are known to have higher surface are per unit volume, contributing to the increase in load to penetrate through this phases [18].…”

Influence of indium and zinc oxide nano-particles on properties of SAC0307-xIn-yZnO lead-free solder paste

“…Therefore, the Cu 6 Sn 5 layer type is better than the Cu 3 Sn layer because it is not incentive to Kirkendall voids formation. [15][16][17][18][19]. In this experiment, the interfacial IMC layer has a tendency to increase with the addition of ZnO nano-particles at more than 1.0 wt% to solder.…”