Effects of Dwell Time and Ramp Rate on Lead-Free Solder Joints in FCBGA Packages

Fan, Xuejun; Raiser, G.; Vasudevan, Vasu

doi:10.1109/ectc.2005.1441379

Cited by 18 publications

(2 citation statements)

References 16 publications

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“…It is obvious from Figure 4 that as the ramp time decreases while the cycling time is kept constant, the accumulated inelastic energy density increases. The trend is observed by other researchers as well [7]. Thus, it is clear that temperature changes have significant effects on the reliability of solder joints.…”

Section: Resultsmentioning

confidence: 50%

“…Solder joints' fatigue life in thermal cycling tests has been studied for decades using the finite element method. While many researchers are investigating the influence of thermal cycling on the reliability, it is still a heating-concerned problem to be discussed [4][5][6][7][8]. Xuejun Fan [9] found that the ramp rate, the dwell time, and the frequency of thermal cycling have a great impact on the reliability.…”

Section: Introductionmentioning

confidence: 99%

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Effects of different temperature profile on solder joints in PBGA packages

Wang

Gao

Liu

2013

2013 14th International Conference on Electronic Packaging Technology

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With the current trend of cheaper, faster, and better electronic equipment, it has become increasingly important to evaluate the package and system performance very early in the design cycle using simulation tools [1]. Many studies have shown that the profile of temperature has a great impact on solder joint reliability. Undergoing the different temperature profile will get a different solder joint fatigue life. There is an acceleration model which consists of three variables: the maxtemperature, frequency and arrange of temperature, for lead free (SAC) solder joint reliability under thermal cycling. However, there is a different fatigue life undergoing the temperature profile with the same max-temperature, frequency and arrange of temperature, the ratio of dwelling time/ramp time has a great influence on the fatigue life of lead free solder. In this paper, a parameterized finite element model is presented and used to analyze the change in accumulated inelastic energy density in the solder joint with different ratio of dwelling time/ramp time. By compared the results of each case, it will be shown that the ratio of dwelling time/ramp time has a significant influence on the reliability of solder joints.

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Section: Resultsmentioning

confidence: 50%

Section: Introductionmentioning

confidence: 99%

Effects of different temperature profile on solder joints in PBGA packages

Wang

Gao

Liu

2013

2013 14th International Conference on Electronic Packaging Technology

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Simulation of Thermodynamic Effect for Packaged Enclosures

Peng,

Song,

Zhang

et al. 2024

2024 IEEE International Symposium on Antennas and Propagation and INC/USNC‐URSI Radio Science Meeting (AP-S/INC-USNC-URSI)

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Field Condition Reliability Assessment for SnPb and SnAgCu Solder Joints in Power Cycling Including Mini Cycles

Pei

Fan²,

Bhatti

56th Electronic Components and Technology Conference 2006

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Actual field conditions that computer components such as microprocessors experience are different from the accelerated thermal cycling tests typically used to perform reliability assessment. Field conditions can include longer dwell times, different temperature ramp rates driven by power ON/OFF events, and temperature fluctuations during the power ON state due to workload patterns. Series of numerical simulations have been performed to study the effect of the field conditions on the solder joint fatigue life of electronic packaging. The simulation results show that SnPb and SnAgCu solders respond differently with respect to dwell time and mini cycles. Without considering the effect of minicycles, it is possible that SnAgCu may fail earlier than SnPb with very long dwell time. However, it is important to note if mini-cycles contribute to damage as seen in this analysis, the SnPb solder will probably still fail before SnAgCu solder.

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Effects of Dwell Time and Ramp Rate on Lead-Free Solder Joints in FCBGA Packages

Cited by 18 publications

References 16 publications

Effects of different temperature profile on solder joints in PBGA packages

Effects of different temperature profile on solder joints in PBGA packages

Simulation of Thermodynamic Effect for Packaged Enclosures

Field Condition Reliability Assessment for SnPb and SnAgCu Solder Joints in Power Cycling Including Mini Cycles

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