“…Issues such as substrate bending, [10,11] elastic coupling, [5] electrostatic artifacts between cantilever and substrate, [11,12] top electrode size effects, [13,14] large leakage currents, [15] concentrated inhomogeneous electric fields, [16] and local poling [17] complicate precise measurements. Further, thin-film based measurements (except PFM) usually are known to underestimate parameters like d 33 due to substrate clamping effects; when compared with the bulk material, [5,18] PFM, on the other hand, has been found to overestimate electromechanical coefficients d 33 . [11,12] To develop new materials and device designs for the thin-film-based MEMS industry, uncomplicated, competent, and robust methods of characterization are essential.…”