¹1 at low P p (0.06) at 77 K, indicator of high industrial reliability of production process, was 0.33 MGy, which was more than 3.7 times broader than that at 298 K. Based on the 3-parameter Weibull equation, the lowest o F p value at P p of zero (F s ) could be estimated. The 0.22 MGy-HLEBI at 77 K apparently improves the F s , which was higher than that 0.22 MGy-HLEBI at 298 K. Decreasing the irradiation temperature from 298 to 77 K controlled the rapid adhesion and rapid decay of adhesion at low-P p , which were mainly caused by the low forming ability of dangling bonds induced by strong apparent bonding force, which is related to decreasing atoms vibration energy. Since the 0.22 MGy-HLEBI at 77 K controlled the recovery of dangling bonds and generated the chemical bonds, the strong adhesive force of PTFE/PDMS treated by 0.22 MGy-HLEBI at 77 K could be explained. Therefore, HLEBI under liquid nitrogen was useful tool for quick strong PTFE/PDMS lamination with sterilization for bio-adaptable application.