Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni

Wang, Chao-hong; Li, Kuan-Ting

doi:10.1007/s11664-016-4763-3

Cited by 3 publications

(1 citation statement)

References 21 publications

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“…In soldering applications, minor gallium additions in Sn-based solder was intended to enhance wettability, mechanical strength, maximum elongation, and suppress IMC overgrowth [7,8]. Nickel, on the other hand, is often plated on copper substrates to serve as the diffusion barrier layer [9]. Academic resources have extensively studied the rate of Ni or Ni alloy consumption through IMC formation or dissolution when immersed in gallium alloys [10][11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Phase Equilibria Related to NiGa5 in the Binary Ni-Ga System

Chang,

Kao

2024

Materials

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The assembly of Ga alloys with Ni or Ni alloy has been widely developed for various low-temperature applications in recent years. In the constituent Ni-Ga binary system, however, the phase equilibrium with the phase “NiGa5” and its stability has scarcely been investigated. The present study used the diffusion couple technique combined with SEM-EPMA and XRD analysis to examine the phase stability and the homogeneity range of the phase. The results show that “NiGa5” is a stable phase in the binary system with little homogeneity range and suggest that the peritectic reaction L+Ni3Ga7→NiGa5 lies between 112.0 and 115.5 °C. This work provides new information for the modification of the Ga-rich low-T region of the Ni-Ga phase diagram.

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