Understanding
the dynamics of the laser crystallization (LC) process
of Ge thin films by nanosecond (ns) pulsed infrared (IR) lasers is
important for producing homogeneous, crack-free crystalline device-grade
films for use in thin-film transistors, photo-detectors, particle
detectors, and photovoltaic applications. Our motivation is to describe
a ns IR laser-based crystallization process of Ge by implementing
suitable parameters to fabricate thin-film devices. Our LC technique
was applied to crystallize thin amorphous Ge (a-Ge) films with thicknesses
suitable for device applications. The LC process was applied to a
300 nm-thick a-Ge thin film utilizing a 200 ns pulsed IR laser with
a wavelength of 1064 nm. Electron-beam-evaporation-deposited a-Ge
on glass substrates were subject to successive ns laser pulses with
a line focus. The crystallinity of the polycrystalline Ge (pc-Ge)
films was evaluated by Raman spectroscopy, optical microscopy, and
electron backscatter diffraction (EBSD). LC-Ge exhibited a Raman peak
of around 300 cm–1, confirming successful crystallization
of a-Ge. pc-Ge domain sizes exceeding several tens of micrometers
were observed in EBSD scans. LC of a-Ge minimizes the thermal energy
budget of processing and provides flexibility to locally crystallize
the film. Our work is the first demonstration of the LC of a-Ge thin
films, resulting in domain sizes exceeding tens of micrometers via
a ns pulsed IR laser.