Al-12Si-1.0Mn-0.6Mg-xSc (x = 0, 0.1, 0.2, and 0.3) alloys for electronic packaging were prepared by ingot metallurgy, and the microstructure, mechanical properties, thermo-physical properties and corrosion resistance were compared. A fine and dispersed Al3Sc phase is observed and the acicular β-Fe phase transforms into a Chinese character or massive α-Fe phase in the alloys with Sc addition. When the Sc content increases from 0 to 0.3%, the secondary dendritic arm spacing and the size of the eutectic Si reduce from 17.9 μm and 5.3 μm to 12.8 μm and 3.1 μm, respectively. Simultaneously, the morphology of eutectic Si changes from a rough long rod to an ellipsoid. The thermal expansion coefficient and thermal conductivity of the alloys reduce slightly with increasing the Sc content. The flexural strength of 291.9 MPa is obtained for the Al-12Si-1.0Mn-0.6Mg-0.3Sc, an increment of 20.4% as compared with the Sc-free alloy. Furthermore, the corrosion resistance of the alloys is improved by the minor Sc addition.