2021
DOI: 10.1109/jestpe.2020.3038561
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Effects of High-Field Velocity Saturation on the Performance of V-Doped 6H Silicon-Carbide Photoconductive Switches

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Cited by 19 publications
(6 citation statements)
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“…A packaging method for SiC devices is proposed, forming an overall packaging design and processing technology scheme. The problem of achieving the stable operation of a single device with 20 kV high power capacity has been solved through continuous research and optimization of the structure, the processing technology, and the device fabrication of vertical PCSDs [55] . Figure 6 shows the typical structure of a vertical PCSD.…”
Section: Progress In Device Fabrication and Processingmentioning
confidence: 99%
“…A packaging method for SiC devices is proposed, forming an overall packaging design and processing technology scheme. The problem of achieving the stable operation of a single device with 20 kV high power capacity has been solved through continuous research and optimization of the structure, the processing technology, and the device fabrication of vertical PCSDs [55] . Figure 6 shows the typical structure of a vertical PCSD.…”
Section: Progress In Device Fabrication and Processingmentioning
confidence: 99%
“…Extrinsic absorption occurs when the photon energy is smaller than the bandgap. Vertical PCSS with electrodes on opposite side of the substrate are widely illuminated by an extrinsic laser such as waveleng of 532 nm (double frequency of Nd:YAG 1064 nm wavelength) [16], [17]. The breakdown voltage of vertical PCSS is high for the thick substrate ~mm dimension level, and the current density can be controlled with a large current cross section since the electrode of vertical power PCSS is about mm-cm dimension.…”
Section: Introductionmentioning
confidence: 99%
“…So, it can make full use of high breakdown field properties of bulk materials and assure the bulky current flow [18]. V-doped SiC PCSS can achieve extrinsic absorption through impurity absorption [9], and researchers have paid attention on vertical SiC PCSS with extrinsic 532-nm-wavelength laser in terms of high output power, high photoelectric conversion efficiency, and so on [16], [17], [18]. Sullivan has reported that the power capacity of a single thickness of 1 mm and side width of 1 cm square SiC wafer is 22.4 MW (16 kV bias voltage and 1.4 kA peak current) with a 5 MW peak optical power input [9].…”
Section: Introductionmentioning
confidence: 99%
“…The laser light can be introduced to the vPCSS by surface normal illumination or side illumination. A transparent conductive window is introduced on one of the electrodes in the vPCSS for the surface normal illumination [28]- [30]. Because the devices were illuminated by the 532-nm laser light, they suffer from low optical absorption efficiency.…”
Section: Introductionmentioning
confidence: 99%