Effects of inclination angle and heat power on heat transfer behavior of flat heat pipe with bionic grading microchannels

Li, Hongwei; Ren, Jian; Yin, Dandan; Lu, Guolong; Du, Changqing; Jin, Xu; Jia, Yuting

doi:10.1016/j.applthermaleng.2022.118079

Cited by 32 publications

(3 citation statements)

References 34 publications

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“…Similarly, PMMA hierarchical microchannels with three low ribs having a thickness of 58 μm prepared using the micromilling method achieved a capillary rise height of 42 mm in 3 s, whereas our corresponding NS30 achieved 57.8 mm in the same time. Bionic grading microchannels with 500 μm thickness were prepared by laser etching on a copper plate with three low ribs, yet the capillary rise height was not outstanding, only 20 mm in 9 s; at the same moment, the capillary rise height of our experiment was 4.5 times higher. Dual-scale microgrooves composed of main microgrooves and periodic submicrogrooves in ridge valleys with a thickness of 95 μm were formed on the surface of AA6061 by two-step laser texturing, achieving a capillary rise height of 80 mm in 11 s under pumping and reduced flow-resistance effects.…”

Section: Resultsmentioning

confidence: 64%

“…The results showed that the capillary rise height could reach 42 mm in 3 s using a hierarchical channel structure consisting of one major microchannel with three low ribs inside. Similarly, Li et al 29 prepared bionic grading microchannels with high and low structural surfaces on copper plates. These bionic grading copper wicks could reach a rise height of 20 mm compared to the 18 mm of micro-V groove wicks.…”

Section: Introductionmentioning

confidence: 99%

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High-Performance Bioinspired Hierarchical Microgroove Wick for Ceramic Vapor Chambers Achieved by Nanosecond Pulsed Lasers

Yuan,

Yan,

Huang

et al. 2024

Langmuir

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Directly integrating ceramic vapor chambers into the insulating substrate of semiconductor power devices is an effective approach to solve the problem of heat dissipation. Microgrooves that could be machined directly on the shell plate without contact thermal resistance and mechanical dislocation offer exciting opportunities to achieve high-performance ceramic vapor chambers. In this study, a bioinspired hierarchical microgroove wick (BHMW) containing low ribs via one-step nanosecond pulsed laser processing was developed, as inspired by the Sarracenia trichome. The superwicking behavior of microgrooves with different structural parameters was investigated using capillary rise tests and droplet-spreading experiments. The BHMW exhibited excellent capillary performance and anisotropic hemiwicking performance. At a laser scanning spacing of 30 μm, the BHMW achieved a capillary wicking height of 114 mm within 20 s. The optimized BHMW demonstrated a capillary parameter (ΔP c •K) and an anisotropic hemiwicking ratio of 4.46 × 10 −7 N and 11.93, respectively, which were 1182 and 946% higher than references, as achieved through nanosecond pulsed laser texturing under identical parameters. This work not only develops a high-performance hierarchical alumina microgroove wick structure but also outlines design guidelines for high-performance ceramic vapor chambers for thermal management in semiconductor power devices.

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Section: Resultsmentioning

confidence: 64%

Section: Introductionmentioning

confidence: 99%

High-Performance Bioinspired Hierarchical Microgroove Wick for Ceramic Vapor Chambers Achieved by Nanosecond Pulsed Lasers

Yuan,

Yan,

Huang

et al. 2024

Langmuir

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show abstract

“…This is mainly because the top width of both microchannels is wider than that of the rectangular channel, which is suitable for the growth of bubbles. Li et al [80] designed a biomimetic microchannel flat heat pipe with a rectangular structured surface based on the strong water-collection and water-transfer capabilities of the Nepenthes surface for use in a fuel cell plate temperature control device (Fig. 21b).…”

Section: Geometric Design Of Microchannels In Boiling Heat Transfermentioning

confidence: 99%

Topological structures for microchannel heat sink applications – a review

Wang

et al. 2023

Manufacturing Rev.

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The microchannel heat sink (MCHS) has the advantages of small heat transfer resistance, high heat transfer efficiency and small size, which exhibits good heat transfer performance in the field of active heat dissipation of electronic devices integrated with high heat flux density. In this paper, the application of MCHS in thermal management is reviewed in recent years, and the research progress of microchannel topology on enhancing heat transfer performance is summarized. Firstly, the research progress on the cross-sectional shape of the microchannel shows that the heat transfer area and fluid flow dead zone of the microchannel is the keys to affecting the heat transfer performance; Secondly, the microchannel distribution and the bionic microchannel structure have a great role in enhancing heat transfer performance, especially in microchannel temperature uniformity; Thirdly, the disturbing effect caused by interrupted structures in microchannels such as ribs and concave cavities has become a hot topic of research because it can weaken the thermal boundary layer and increase heat dissipation. Finally, the commonly used MCHS materials and cooling media are summarized and introduced. Based on the above reviews of MCHS research and applications, the future trends of MCHS topologies are presented.

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Multimodal transient topology optimization design of heat dissipation structure in electric aircraft power cabin

Wang,

Li,

Wang

et al. 2024

Applied Energy

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Effects of inclination angle and heat power on heat transfer behavior of flat heat pipe with bionic grading microchannels

Cited by 32 publications

References 34 publications

High-Performance Bioinspired Hierarchical Microgroove Wick for Ceramic Vapor Chambers Achieved by Nanosecond Pulsed Lasers

High-Performance Bioinspired Hierarchical Microgroove Wick for Ceramic Vapor Chambers Achieved by Nanosecond Pulsed Lasers

Topological structures for microchannel heat sink applications – a review

Multimodal transient topology optimization design of heat dissipation structure in electric aircraft power cabin

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