Ultraviolet ͑UV͒, low penetration depth, micro-Raman spectroscopy, and high-resolution x-ray diffraction ͑HRXRD͒ are utilized as complementary, independent stress characterization tools for a range of strained Si samples doped by low energy ͑2 keV͒ Sb ion implantation. Following dopant implantation, good agreement is found between the magnitudes of strain measured by the two techniques. However, following dopant activation by annealing, strain relaxation is detected by HRXRD but not by micro-Raman. This discrepancy mainly arises from an anomalous redshift in the Si Raman peak position originating from the high levels of doping achieved in the samples. This has serious implications for the use of micro-Raman spectroscopy for strain characterization of highly doped strained Si complementary metal-oxide semiconductor devices and structures therein. We find a direct correlation between the Si Raman shift and peak carrier concentration measured by the differential Hall technique, which indicates that UV micro-Raman may become a useful tool for nondestructive dopant characterization for ultrashallow junctions in these Si-based materials. The enhancement of carrier mobilities through the introduction of strain in the channel region of metal-oxide semiconductor field effect transistors is an important option in order to maintain historical complementary metal-oxide semiconductor ͑CMOS͒ performance trends. 1 The production of ultrashallow junctions for the source/drain extension region using low energy ion implantation will be required for future CMOS devices. Biaxial tensile strain reduces the sheet resistance ͑R S ͒ of highly doped n type layers created by As or Sb implantation. The effect can be stronger for Sb, when R s lowering results not only from strain enhanced mobility, but also from an improvement in Sb metastable solubility in the presence of strain. 2 This makes Sb an interesting alternative to As for ultrashallow junctions in strain-engineered CMOS devices. Since an early study by Anastassakis et al., 3 Raman scattering has been widely used as a strain characterization technique in the semiconductor industry 4-6 and is often utilized for strain metrology in strained Si films. 7,8 Our results show that there are practical difficulties associated with the use of micro-Raman as a strain characterization technique for highly doped ultrashallow junction Si CMOS device structures.Experiments were performed on two types of tensilestrained Si wafers each grown on Si 1−x Ge x relaxed buffer layers with x = 0.2 and x = 0.17, and strained Si thicknesses of 43 and 17.5 nm, respectively. Each wafer was implanted with a 2 keV Sb ion dose of between 1 ϫ 10 14 and 1 ϫ 10 15 cm −2 creating a junction at a depth of around 10 nm.Nominally unstrained control samples were prepared using conventional p-type Si wafers for comparison. The implanted dose was confirmed by medium-energy ion scattering ͑MEIS͒. Dopant activation was achieved by rapid thermal annealing ͑RTA͒ wafer pieces for 10 s in N 2 in the range of 600-800°C. Room ...