2019
DOI: 10.1016/j.matchar.2019.02.002
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Effects of interface area density and solid solution on the microhardness of Cu-Nb microcomposite wires

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Cited by 26 publications
(14 citation statements)
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“…Instead of Cu grain boundaries, a high density of Cu-Nb interfaces were created in the Cu 4 +Nb region. Such interfaces often play an important role in determining the properties of composite materials [1,19,41,42] and are especially important in composites with nanoscale microstructures, since a large number of defects are present [43,44]. Misfit dislocations and vacancies can act as obstacles for dislocation movement and are ideal sinks for dislocation annihilation [44].…”
Section: Texture Analysismentioning
confidence: 99%
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“…Instead of Cu grain boundaries, a high density of Cu-Nb interfaces were created in the Cu 4 +Nb region. Such interfaces often play an important role in determining the properties of composite materials [1,19,41,42] and are especially important in composites with nanoscale microstructures, since a large number of defects are present [43,44]. Misfit dislocations and vacancies can act as obstacles for dislocation movement and are ideal sinks for dislocation annihilation [44].…”
Section: Texture Analysismentioning
confidence: 99%
“…The large number of embedded Nb fibers affects the deformation and texture development of the Cu matrix [18]. A variety of constraints, including the Cu-Nb interface area and the matrix dimensions, will alter the deformation compared to non-composite FCC materials [19]. It is well established that the texture exerts a strong influence on the mechanical properties and electrical conductivity of such materials.…”
Section: Introductionmentioning
confidence: 99%
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