Effects of Metal Surface Conditions on Interfacial Characteristics between Metal and Epoxy Resin

Abstract

Conductive adhesives are alternatives to solder joints and are of interest because of their high bonding strength, low thermal resistance, and low electrical resistance. In this paper, we focused on the dependence of the metal surface conditions on the surface processing and clari ed the effect of different metal surface nishes on the bonding strength and thermal characteristics. The effects of air exposure and silane coupling agent processing on the adhesive strength between the metal and resin were investigated. The thermal resistance after repeated bending was measured to determine the effect of different metal surface nishes on the thermal resistance.

Recent Development of Joining and Conductive Materials for Electronic Components

“…6) titled Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials. 1) The issue introduces special interconnection technologies that deal with solder alloys, 27) wire bonding, 8) electrodeposited film, 9) conductive adhesives, 10,11) diffusion joining, 1214) and joint interface science. 15,16) In 2019, the part II of the special issue was published in the journal (Vol.…”