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Conductive adhesives are alternatives to solder joints and are of interest because of their high bonding strength, low thermal resistance, and low electrical resistance. In this paper, we focused on the dependence of the metal surface conditions on the surface processing and clari ed the effect of different metal surface nishes on the bonding strength and thermal characteristics. The effects of air exposure and silane coupling agent processing on the adhesive strength between the metal and resin were investigated. The thermal resistance after repeated bending was measured to determine the effect of different metal surface nishes on the thermal resistance.

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