Effects of nitrogen flow rates on the growth morphology of TiAlN films prepared by an rf-reactive sputtering technique

Chakrabarti, Kaushik; Jeong, Jinho; Hwang, Sun Keun; Yoo, Yongjae; Lee, C.M.

doi:10.1016/s0040-6090(01)01791-6

Cited by 60 publications

(39 citation statements)

References 19 publications

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“…Hence crystal planes (200) having higher surface energy are formed at the expense of others. Similar observations have also been reported by Chakrabati et al [6] and Kim et al [13]. The films deposited at a N 2 flow rate of 2 sccm and a substrate temperature of 873 K reveal two major reflections corresponding to 200 and 220.…”

Section: Resultssupporting

confidence: 88%

“…The increase in grain size with increasing substrate temperature is because of increased adatom mobility at higher temperatures. Decrease in grain size of Ti x Al 1-x N films with increasing N 2 flow rate has also been observed recently [6,14]. Ti 1-x Al x N films have been deposited on Si (111) substrates by reactive DC magnetron sputtering and the effects of N 2 flow rate and substrate temperature on the grain size and surface roughness of the films have been investigated by atomic force microscopy.…”

Section: Afm Analysismentioning

confidence: 68%

“…Under a high temperature oxidizing ambient, Ti 1-x Al x N forms a superficial layer of amorphous Al 2 O 3 at the surface that prevents further oxidation [3][4][5]. In addition it also has low thermal conductivity that enabled higher cutting speeds [6]. Hence Ti 1-x Al x N coatings have attracted substantial research and industrial interest in recent years.…”

Section: Introductionmentioning

confidence: 99%

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The influence of N₂ flow rate and substrate temperature on Ti_1‐xAl_xN thin films

Irudayaraj

Kalainathan

2008

Cryst. Res. Technol.

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Titanium aluminium nitride (Ti 1-x Al x N) films have been deposited on silicon (111) substrate at a N 2 flow rate of 2 sccm and 20 sccm and at a substrate temperature of 773 K and at a N 2 flow rate of 2 sccm and at a substrate temperature of 873 K by reactive DC magnetron sputtering technique. The effect of N 2 flow rate and substrate temperature on the grain size and surface roughness of the deposited films have been investigated. The films have been analysed by X-ray diffraction (XRD) and atomic force microscopy (AFM). The films were found to be nanocrystalline. While the grain size of the films decreases with increasing N 2 flow rate and decreases with increasing substrate temperature, the surface roughness of the films decreases with increasing N 2 flow rate and increases with increasing temperature.

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Section: Resultssupporting

confidence: 88%

Section: Afm Analysismentioning

confidence: 68%

Section: Introductionmentioning

confidence: 99%

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The influence of N₂ flow rate and substrate temperature on Ti_1‐xAl_xN thin films

Irudayaraj

Kalainathan

2008

Cryst. Res. Technol.

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“…The nitrogen content influenced the amorphous and crystalline phase formation and affected the coating hardness. The columnar morphology of the TiAlN became denser with an increasing nitrogen flow rate, which may increase the coating hardness [15]; however, the present study results show that, generally, the coating hardness decreased with the increase of the nitrogen flow rate. This is probably due to the new phase formation from the reaction between Al and N [11,16].…”

Section: Resultscontrasting

confidence: 78%

The Mechanical and Tribology Properties of Sputtered Titanium Aluminum Nitride Coating on the Tungsten Carbide Insert Tool in the Dry Turning of Tool Steel

Budi¹,

Muhamad²,

Rahman³

2015

MST

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The effect of the sputtering parameters on the mechanical tribology properties of Titanium Aluminum Nitride coating on the tungsten cabide insert tool in the dry turning of tool steel has been investigated. The coating was deposited using a Direct Current magnetron sputtering system with various substrate biases (-79 to -221 V) and nitrogen flow rates (30 to 72 sccm). The dry turning test was carried out on a Computer Numeric Code machine using an optimum cutting parameter setting. The results show that the lowest flank wear (~0.4 mm) was achieved using a Titanium Aluminum Nitride-coated tool that was deposited at a high substrate bias (-200 V) and a high nitrogen flow rate (70 sccm). The lowest flank wear was attributed to high coating hardness. AbstrakSifat Mekanik dan Tribologi Lapisan Titanium Aluminium Nitrida pada Perkakas Tungsten Karbida dalam Pemotongan Kering Baja. Telah dilakukan penelitian mengenai pengaruh parameter sputering terhadap sifat mekanik dan tribologi lapisan Titanium Aluminum Nitrida pada perkakas potong tungsten karbida dalam proses pemotongan turning kering baja perkakas. Deposisi lapisan tipis dilakukan menggunakan sistem sputtering magnetron dengan variasi tegangan substrate (-79 s/d -221 Volt) dan laju alir gas nitrogen (30 s/d 72 sccm). Pemotongan turning kering dilakukan menggunakan mesin bubut otomatis CNC dengan parameter pemotongan optimum. Hasil percobaan menunjukan bahwa aus sisi terendah (~0.4 mm) perkakas ditunjukan oleh lapisan Titanium Aluminum Nitrida yang dideposisikan pada tegangan substrat (-200 V) dan laju alir gas nitrogen (70 sccm) tinggi. Rendahnya aus sisi perkakas diakibatkan oleh tingginya nilai kekerasan lapisan.

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“…[2] The addition of aluminium (Al) into this TiAlN layer has been known can increase its wear and oxidation properties through the formation of Al 2 O 3 dense layer when heated in elevated temperature [7]. This layer will act as a protective layer to prevent diffusion of oxygen into the covered surface [3] and also can lubricate the friction pair contact and isolate the coating underneath [6]. There have been many methods to synthesize TiAlN thin layer such as magnetron sputtering, arc evaporation, ion beam-assisted deposition and arc bonding sputtering [12].…”

Section: Introductionmentioning

confidence: 99%

Deposition of Titanium Aluminium Nitride Thin Layer on High Speed Steel Substrate by Radio Frequency Sputtering

Wicaksono

Prayukti

Purniawan

et al. 2017

IJPS

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High Speed Steel (HSS) has been widely used in manufacturing industry as one of cutting tool materials because of its good mechanical properties yet with a low price. However, since this material has a low thermal resistance property, it will limit its application when used in dry cutting process. Several methods have been used to improve the cutting performance of HSS in dry cutting. One of them was by growing a thin layer of hard coating on the contact surface of the cutting tool material. In this research, Titanium Aluminium Nitride layer were deposited on AISI M41 High Speed Steel substrate by using Radio Frequency (RF) Sputtering method. The aims of this study were to analyze the effect of variations of Aluminium surface area ratios (10, 20, 30, and 40 %) on the Titanium target and also to analyze the effect of deposition time (15, 30, and 45 minutes) on the composition, phase characterization and morphology of the thin layer that formed. The formation of TiAlN and AlN crystalline compounds were observed by X-Ray Diffraction method. A dense layer with a thickness range from 1.4 to 5.2 µm was observed by using a Scanning Electron Microscopy. It was known that the deposition time affect the thickness and also the roughness of the layer. The topography images by Atomic Force Microscopy showed that the deposition time of 45 minutes produce the finest layer with the surface roughness of 10.8 nm.

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Effects of nitrogen flow rates on the growth morphology of TiAlN films prepared by an rf-reactive sputtering technique

Cited by 60 publications

References 19 publications

The influence of N₂ flow rate and substrate temperature on Ti_1‐xAl_xN thin films

The influence of N₂ flow rate and substrate temperature on Ti_1‐xAl_xN thin films

The Mechanical and Tribology Properties of Sputtered Titanium Aluminum Nitride Coating on the Tungsten Carbide Insert Tool in the Dry Turning of Tool Steel

Deposition of Titanium Aluminium Nitride Thin Layer on High Speed Steel Substrate by Radio Frequency Sputtering

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Effects of nitrogen flow rates on the growth morphology of TiAlN films prepared by an rf-reactive sputtering technique

Cited by 60 publications

References 19 publications

The influence of N2 flow rate and substrate temperature on Ti1‐xAlxN thin films

The influence of N2 flow rate and substrate temperature on Ti1‐xAlxN thin films

The Mechanical and Tribology Properties of Sputtered Titanium Aluminum Nitride Coating on the Tungsten Carbide Insert Tool in the Dry Turning of Tool Steel

Deposition of Titanium Aluminium Nitride Thin Layer on High Speed Steel Substrate by Radio Frequency Sputtering

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The influence of N₂ flow rate and substrate temperature on Ti_1‐xAl_xN thin films

The influence of N₂ flow rate and substrate temperature on Ti_1‐xAl_xN thin films