Effects of parylene coating on the thermal fatigue life of solder joints in ceramic packages

Tong, Ho‐Ming; Mok, L.; Grebe, K. R.; Yeh, H.L.; Srivastava, K.K.; Coffin, J.

doi:10.1109/33.239887

Cited by 13 publications

(3 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Parylene films with different functional groups have been extensively studied as encapsulation materials for biomedical or microelectronic applications; examples include stents, pacemakers, microelectronics, capacitive sensors, and solder joints. (1)(2)(3)(4)(5)(6)(7) Among the Parylene variants, Parylene-N and -C are currently approved by the Food and Drug Administration (FDA) as class VI polymers, allowing them to be used in biomedical devices. (8) A fully integrated, wireless neural interface device is being developed to restore functions to patients with neurological disorders, (9) and Parylene-C was studied as a conformal, hermetic, and biocompatible encapsulation layer for the device.…”

Section: Introductionmentioning

confidence: 99%

Effect of Thermal and Deposition Processes on Surface Morphology, Crystallinity, and Adhesion of Parylene-C

Hsu

Rieth

Kammer

et al. 2008

Sensors and Materials

View full text Add to dashboard Cite

Neural interface devices have been developed for neural science and neuroprosthetics applications to record and stimulate neural signals. Chemical-vapor-deposited Parylene-C films were studied as an encapsulation material for such an implantable device. The surface morphology of an implant affects its biocompatibility; thus, the Parylene-C surface morphology was investigated as a function of the precursor sublimation rate by atomic force microscopy. We found that high precursor sublimation rates resulted in slightly higher root-mean-square surface roughnesses (from 5.78 to 9.53 nm for deposition rates from 0.015 to 0.08 g/min). The crystallinity affects the physical properties of semicrystalline polymers, and various heat treatments were found to modify the crystallinity of Parylene-C films, as assessed by X-ray diffraction (XRD). The XRD peak at 2θ = ~14.5° increased in intensity and decreased in full width at half maximum with increasing annealing temperature, indicating an increase in film crystallinity. Poor adhesion would compromise the protection offered by Parylene-C coatings. The adhesion between Parylene-C and silicon, amorphous silicon carbide, and boron silicate glass substrates were evaluated using the standard tape adhesion test from the American Society for Testing and Materials (ASTM) in an attempt to minimize the occurrence of delamination failures. The tape adhesion tests indicated strong adhesion for all the as-deposited Parylene films with the application of an adhesion promoter (Silquest A-174 ® silane). However, annealing the deposited films at temperatures from 85 to 150°C in air for 20 min reduced film adhesion, and also the adhesion testing procedure used significantly affects the results obtained. Supporting evidence suggested that the thermal stress generated in the films weakened the adhesive force. We concluded that 88 Sensors and Materials, Vol. 20, No. 2 (2008) the Parylene-C film properties (surface morphology, crystallinity, and adhesion) changed during deposition and thermal annealing, suggesting that the Parylene-C film properties can be tailored and that, with care, failure due to film delamination can be avoided.

show abstract

Section: Introductionmentioning

confidence: 99%

Effect of Thermal and Deposition Processes on Surface Morphology, Crystallinity, and Adhesion of Parylene-C

Hsu

Rieth

Kammer

et al. 2008

Sensors and Materials

View full text Add to dashboard Cite

show abstract

“…The causes that are usually related to the failure solder joints include (1) strain accumulation due to thermal cyclic load; (2) large shear force due to excessive mismatch of thermal expansion; (3) inadequate material strength and resistance to shock and vibration. Solder joint reliability research [27][28][29][30][31][32][33][34][35][36][37][38][39] has become one of the most important areas of research in the development of reliable electronic components.…”

Section: Solder Joint Reliabilitymentioning

confidence: 99%

“…optimization [27,34,37] and failure analysis of solder joints [34,[42][43]. Typical Compared with the simulation of ATC, power cycling simulation [67][68][69][70] were run in the temperature cycling simulation; stress and strain distributions were [27,36,[64][65][66].…”

Section: Finite Element Analysis Of Soldered Assembliesmentioning

confidence: 99%

Micro-deformation characterization of electronic packaging materials and assemblies

Sun¹

View full text Add to dashboard Cite

I wish to express my gratitude and appreciation to my supervisor AlP John, H.L. Pang, who has provided me not only invaluable professional knowledge in mechanics of electronic packaging, but also encouragement, support, and inspirations for exploring this research topic, as well as improving myself. I thank Dr. Shi Xunqing for bringing me to Singapore and into the area of digital image correlation for deformation measurements, where I located my research interests. His guidance made my academic dream in Nanyang Technological University (NTU) come true. I would also like to thank my former group manager Stephen, c.K. Wong in Singapore Institute of Manufacturing Technology (SIMTech) for his support when I worked in SIMTech. Many sincere thanks go to my former colleagues in SIMTech and in NTU who have provided much useful assistance during the experimental part of this research and invaluable discussion. These include Dr.

show abstract

Underfill: The Enabling Technology for Flip-Chip Packaging

Buchwalter¹,

Edwards

Gamota

et al. 2001

Area Array Interconnection Handbook

View full text Add to dashboard Cite

Effects of parylene coating on the thermal fatigue life of solder joints in ceramic packages

Cited by 13 publications

References 2 publications

Effect of Thermal and Deposition Processes on Surface Morphology, Crystallinity, and Adhesion of Parylene-C

Effect of Thermal and Deposition Processes on Surface Morphology, Crystallinity, and Adhesion of Parylene-C

Micro-deformation characterization of electronic packaging materials and assemblies

Underfill: The Enabling Technology for Flip-Chip Packaging

Contact Info

Product

Resources

About