Effects of rare earth cerium addition on the synthesis and corrosion resistance of electroless Ni–PTFE–P coating

Liu, D.; Zhou, Lulu; Yu, Jie; Yan, Yixin; Lee, Kee‐Ahn

doi:10.1002/maco.200905523

Cited by 14 publications

(8 citation statements)

References 17 publications

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“…In addition, it has been proved that rare earth element can reduce surface tension and interfacial energy between the generated H 2 bubble and the as-deposited layer. 50 It might be anticipated that the porous structure resulted from the emission of hydrogen during HCHO oxidation process disappears, causing a smoother and denser copper layer, as shown in Figure 6c. During the process of ECP, the thickness of copper shell can be easily tuned by altering the loading of PS.…”

Section: D435mentioning

confidence: 99%

Preparation of Highly Uniform and Monodisperse PS/Cu Composite Microspheres Using Electroless Plating

Zhang

2012

J. Electrochem. Soc.

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Highly uniform and monodisperse core-shell microspheres composed of a polystyrene (PS) core and a copper shell were prepared by dispersion polymerization of styrene followed by electroless copper plating. The formation of copper shell on PS surface was confirmed by FESEM, TEM, XRD and TGA. As a result, the plating bath composition had an important influence on the morphology of PS/Cu composites. The addition of Na 2 EDTA and La 2 O 3 as a complexant and a stabilizer led to the formation of a more compact copper shell on PS surface. The formation mechanism was explored by the linear sweep voltammetry method, and the different morphology might mostly result from the various nucleation rates. Tailoring of shell thickness can be achieved through altering the loading of PS in the ECP bath. Conductivity of the PS/Cu composites with a shell thickness of 195 nm is up to 2.2×10 5 S/m. The PS/Cu composites may have great potential to be used as fillers of anisotropic conductive film for their uniform diameter, low density and good conductivity.As the requirements for interconnection and joining materials in microelectronics packaging applications have moved toward ultrafine-pitch bonding and environmental friendliness, anisotropic conductive film (ACF) has gained much attention as an alternative to tin/lead (Sn/Pb) solders. 1,2 ACF not only allow products to be thinner, smaller and lighter, but also offer good electrical performance and stability. 3 ACFs mainly consist of polymeric binder matrices and conductive fillers. 4 When heat and pressure are applied during bonding, the electric connection is established only in the Z-direction by using a relatively low weight loading of conductive fillers, typically 1-10 wt%. 5 Originally, carbon fibers were used as the conductive fillers for ACF. Then, the fillers were replaced by lead-free solder spheres and metal spheres, such as nickel, silver and gold-coated Ni spheres. 6 For instance, there has been growing interest in copper with various sizes and shapes used as filler of isotropic or anisotropic conductive adhesive owing to its high electrical, thermal conductivity, low cost and electro-migration tendency. 7-10

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Section: D435mentioning

confidence: 99%

Preparation of Highly Uniform and Monodisperse PS/Cu Composite Microspheres Using Electroless Plating

Zhang

2012

J. Electrochem. Soc.

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“…Among these surface modification methods, electroless plating of Ni‐P coating is a preferred way to enhance the corrosion and wear resistance for steel, copper and magnesium alloy pieces with irregular shapes . The microstructure and properties of an electroless plated Ni‐P coating are mainly depended on the phosphorus content in the coating .…”

Section: Introductionmentioning

confidence: 99%

Preparation and corrosion resistance of Ni‐P bilayer on magnesium alloy

Yuan

Gao

Wang

et al. 2017

Materials & Corrosion

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Ni‐P bilayers were prepared on AZ61 magnesium alloy by electroless plating method in dual baths with pH value of 11.0 and 5.5. The thickness, surface morphology, composition, structure and corrosion resistance of Ni‐P bilayer were observed and determined by scanning electron microscope (SEM), energy dispersive X‐ray spectrometry (EDX), X‐ray diffractometer (XRD) and electrochemical workstation. The results show that Ni‐P bilayer is composed of inner layer in mixed amorphous and nanocrystalline structure with phosphorus content of 3.9–4.0% and outer layer in amorphous structure with phosphorus content of 8.8–10.9%. The plating time of inner layer has a great impact on the morphology and corrosion resistance of Ni‐P monolayer and bilayer, and the corrosion resistance of Ni‐P bilayer is obviously higher than that of inner layer. The optimum plating condition for Ni‐P bilayer is the combination of inner layer's plating time of 30 min and outer layer's plating time of 180 min, under which Ni‐P bilayer gets a dense structure, smooth surface and higher corrosion resistance than that of single inner layer and outer layer.

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“…In order to obtain coatings with better properties, composite nickel coatings have been developed. Second phase particles dispersed into the nickel matrix can provide good abrasion resistance and high hardness or lubrication ratings. However, the corrosion resistance of composite coatings in comparison to simple Ni‐P is still discussed.…”

Section: Introductionmentioning

confidence: 99%

“…The incorporation of some particles, like Al 2 O 3 , SiO 2 , CeO 2 , SiC, or TiO 2 into the metallic matrix can enhance protective properties , while some researchers claim a reduction in corrosion resistance . Literature reports consistently demonstrate the positive influence of cerium compounds as a component of different coatings on their corrosion resistance , only if good dispersion of ceramic particles is assured. In the case of electrolessly deposited coatings, sol–gel enhanced electroless plating is used .…”

Section: Introductionmentioning

confidence: 99%

Corrosion resistance of Ni-P\CePO₄coatings obtained from sol solutions

Winiarski

Gałuszka

Stankiewicz

2014

Materials and Corrosion

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Combined sol-gel and electroless plating techniques were used to obtain nickelmatrix composite coatings. Scanning electron microscopy (SEM) was used to examine the surface morphology. Energy dispersive spectroscopy (EDS) was employed to analyze the composition of each coating. Corrosion resistance of the coatings was evaluated by electrochemical impedance spectroscopy (EIS). The composite Ni-P\CePO 4 coating was found to have better protective properties against corrosive environments than simple Ni-P. EIS measurements showed that composite coatings had a higher corrosion resistance during first 4 days of exposure to non-deaerated NaCl solution in comparison to Ni-P. The longer the time of exposure (above 4 days), the protective properties of both types of coatings decreased. Eventually, after 16 days of immersion in a corrosive media, simple Ni-P coating was partially damaged, while Ni-P\CePO 4 was still covering a substrate.

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Effects of rare earth cerium addition on the synthesis and corrosion resistance of electroless Ni–PTFE–P coating

Cited by 14 publications

References 17 publications

Preparation of Highly Uniform and Monodisperse PS/Cu Composite Microspheres Using Electroless Plating

Preparation of Highly Uniform and Monodisperse PS/Cu Composite Microspheres Using Electroless Plating

Preparation and corrosion resistance of Ni‐P bilayer on magnesium alloy

Corrosion resistance of Ni-P\CePO₄coatings obtained from sol solutions

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Effects of rare earth cerium addition on the synthesis and corrosion resistance of electroless Ni–PTFE–P coating

Cited by 14 publications

References 17 publications

Preparation of Highly Uniform and Monodisperse PS/Cu Composite Microspheres Using Electroless Plating

Preparation of Highly Uniform and Monodisperse PS/Cu Composite Microspheres Using Electroless Plating

Preparation and corrosion resistance of Ni‐P bilayer on magnesium alloy

Corrosion resistance of Ni-P\CePO4coatings obtained from sol solutions

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Corrosion resistance of Ni-P\CePO₄coatings obtained from sol solutions