Effects of solidification kinetics on microstructure formation in binary Sn–Cu solder alloys

Ventura, Tina; Terzi, S.; Rappaz, M.; Dahle, A. K.

doi:10.1016/j.actamat.2010.11.032

Cited by 75 publications

(46 citation statements)

References 14 publications

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“…These observations are further confirmed by casting experiments of ultrapure Sn-0.9Cu and Sn-0.9Cu-0.03Pb alloys. 5 A very fine eutectic morphology was found in the Sn-0.9Cu alloy, whereas a cellular bimodal eutectic structure similar to the one shown in Figure 1c formed in the Sn-0.9Cu-0.03Pb alloy. This is similar to the observations by Kraft and Albright 8 who found that when the growth rate is very high or the thermal gradient in the liquid at the growing interface is very low, a layer of constitutionally supercooled liquid formed by solute rejection induces a cellular rather than a planar interface of the Al-Al 2 Cu eutectic.…”

Section: Binary Sn-cu Alloysmentioning

confidence: 88%

“…Although the eutectic interface seems planar at this magnification, it is not strictly isothermal at higher magnification, with Cu 6 Sn 5 fibers growing slightly ahead of the Sn matrix. 4 In Figure 2b, the eutectic interface is much more irregular in Sn-0.7Cu-0.03Ni grown at 10 mm/s. The eutectic interface contains perturbations on the order of 50 mm (~0.12 K), which is a typical characteristic of a weakly irregular eutectic, i.e., where the faceted Cu 6 Sn 5 intermetallic phase is only slightly branched.…”

Section: Binary Sn-cu Alloysmentioning

confidence: 99%

“…This is similar to the observations by Kraft and Albright 8 who found that when the growth rate is very high or the thermal gradient in the liquid at the growing interface is very low, a layer of constitutionally supercooled liquid formed by solute rejection induces a cellular rather than a planar interface of the Al-Al 2 Cu eutectic. On the other hand, trace level additions of Ag to ultrapure Sn-0.9Cu resulted in the formation of fine primary b-Sn dendrites, 5 suggesting that Ag could be a potential grain refiner for Sn. However, a separate study refuted this theory and showed that Ag seems to simply stabilize the b-Sn phase field in the phase diagram without refining the microstructure.…”

Section: Binary Sn-cu Alloysmentioning

confidence: 99%

“…4,5 This paper gives an overview on the progress in understanding microstructure formation in this new solder.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Microstructure formation in Sn-Cu-Ni solder alloys

Felberbaum

Ventura

Rappaz

et al. 2011

JOM

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Section: Binary Sn-cu Alloysmentioning

confidence: 88%

Section: Binary Sn-cu Alloysmentioning

confidence: 99%

Section: Binary Sn-cu Alloysmentioning

confidence: 99%

“…4,5 This paper gives an overview on the progress in understanding microstructure formation in this new solder.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Microstructure formation in Sn-Cu-Ni solder alloys

Felberbaum

Ventura

Rappaz

et al. 2011

JOM

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“…% Cu, while Nogita and others report it to be 0.89 wt. % Cu [4,5,6]. In the Sn-rich corner of the alloy phase diagram, the η'-Cu 6 Sn 5 phase of monoclinic structure [7] is formed, representing one of the eutectic phases, the other being the β-Sn solid solution.…”

Section: Introductionmentioning

confidence: 99%

Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

Nagy¹,

Kristály²,

Gyenes³

et al. 2015

Archives of Metallurgy and Materials

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Interfacial intermetallic compounds (IMC) play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint.In the soldering process of Sn-Cu alloys, Cu 6 Sn 5 intermetallic compounds are formed. The complex structural behaviour of Cu 6 Sn 5 IMC is temperature-and composition-dependent and it is long since subject to scientific research. The Cu 6 Sn 5 phase basically exists in two crystal structures: hexagonal η-Cu 6 Sn 5 (at temperatures above 186 • C) and monoclinic η'-Cu 6 Sn 5 (at lower temperatures). In the presence of Ni in the solder, the η-η' transformation does not occur, therefore, the η-Cu 6 Sn 5 phase remains stable.In this study the role of Ni in the (Cu,Ni) 6 Sn 5 intermetallic compound in Sn-Cu lead-free solders was examined. Sn-Cu alloys with different Cu content (0.5 to 1 mass%) were modified through Ni addition. The morphology of the intermetallic compounds of the modified Sn-Cu alloys was investigated by optical microscopy (OM) and scanning electron microscopy (SEM), the IMC phases were examined with X-ray diffraction method (XRD).

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Influence of cooling speed on the solidification of a hyper‐eutectic CuSn alloy

Mardare

Hassel

2012

Physica Status Solidi (a)

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CuSn alloys with a hyper‐eutectic composition (97.53 at% Sn, 2.42 at% Cu and 0.05 at% impurities) were melted in a Bridgman‐type furnace and cooled at different velocities ranging from free fall to 13 µm/s. The formation of the intermetallic phase along the alloys, as well as the size, distribution and microstructure were observed as a function of cooling speed, showing different particle morphologies and growth. The intermetallic phase formed was Cu6Sn5 as confirmed by chemical analysis and X‐ray measurements. Electron backscattered diffraction (EBSD) measurements indicate that the η′‐monoclinic phase of the Cu6Sn5 intermetallic was formed on all samples, together with the β‐Sn. SEM images both transversal and longitudinal cross‐sections of alloys cooled at different velocities.

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Effects of solidification kinetics on microstructure formation in binary Sn–Cu solder alloys

Cited by 75 publications

References 14 publications

Microstructure formation in Sn-Cu-Ni solder alloys

Microstructure formation in Sn-Cu-Ni solder alloys

Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

Influence of cooling speed on the solidification of a hyper‐eutectic CuSn alloy

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