Influence of cooling speed on the solidification of a hyper‐eutectic CuSn alloy

Mardare, Cezarina Cela; Hassel, Achim Walter

doi:10.1002/pssa.201100617

Cited by 7 publications

(7 citation statements)

References 28 publications

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“…Recently, directional solidification studies on the hyper-eutectic side of the Sn-Cu system have been reported [43][44][45]. A rod eutectic with Cu 6 Sn 5 as the leading phase was reported for Sn-1.2Cu alloys cooled at temperature gradients from 2.69 to 8.88 K/mm and pulling speeds from 2.78 to 136.36 µm/s [43].…”

Section: Solidification In the Sn-cu Systemmentioning

confidence: 99%

Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review

McDonald

Read

et al. 2016

Current Opinion in Solid State and Materials Science

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Section: Solidification In the Sn-cu Systemmentioning

confidence: 99%

Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review

McDonald

Read

et al. 2016

Current Opinion in Solid State and Materials Science

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“…The Cu-Sn alloys are well known and frequently used in industries automotive and electronics due to their good thermal conductivity, high strength, good weldability and excellent wear resistance [1][2][3] . The Cu-Sn alloys have a wide solidification interval, which make them susceptible to segregation during the solidification process.…”

Section: Introductionmentioning

confidence: 99%

Investigation of Thermal Parameters Effects on the Microstructure, Microhardness and Microsegregation of Cu-Sn alloy Directionally Solidified under Transient Heat Flow Conditions

et al. 2019

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The microstructure and mechanical properties of cast materials are strongly dependent on the thermal history during solidification process. The global casting industry has faced major challenges, i.e., customers increasingly demand completely finished cast parts as well as complexity of casting alloys are rising. Therefore, the previous knowledge the solidification conditions effects on the ascast ingot microstructure and mechanical properties resulting is very useful in the casting industry in order to improve the casting quality. In this present paper, the thermal parameters effects on the microstructure, microhardness and microsegregation of a Cu-20 wt.% Sn alloy under transient heat flow conditions were experimentally investigated. The experimental observations indicate that the tertiary dendritic arm spacing (λ 3), microsegregation and microhardness are affected by the thermal parameters (solidification speed and cooling rate). Solidification speed (S S) associated with increasing cooling rate (R C) are found to contribute to the decreasing tertiary dendritic arm spacing (λ 3). However, cooling rates from 11.36 °C/s to 0.65 °C/s were not found to affect significantly the microhardness along the ingot length. The solute concentration (Sn) in solid region were calculated by Scheil and Clyne-Kurz equation, and used in the predictions of microsegregation profiles. The results calculated by equations, have shown deviations from the experimental data. It is well known that it is very difficult to calculate these concentration profiles using the equilibrium partition coefficient, since frequently castings solidify under non-equilibrium conditions and the solidification process is known as non-equilibrium solidification. For this reason, effect of solidification speed (S S) was considered into equations through effective partition coefficient (k ef) that has been determined for the range of solidification speed experimentally examined between 0.19 and 0.89 mm/s. However, results calculated by Scheil and Clyne-Kurz equation using the effective partition coefficient (k ef), yielded discrepancies from the experimental results. Because of its deviations between calculated and experimental data, an experimental equation with effective partition coefficient (k ef), is considered in present work, showing an excellent agreement with the experimental data.

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“…The diameters of the hollow in the Cu6Sn5 whisker was about ~2-4 μm. As also indicated by the Cu-Sn phase diagram, the intermetallic Cu6Sn5 phase with approximately 53.5 at % Cu and 46.5 at % Sn and having the typical hollow hexagonal shape was formed in all alloys, together with the β-Sn [20]. The hollow-stick-type Cu6Sn5 forms when the core of the rod dissolves due to the higher energy of screw dislocation and lower Cu concentration, and fills with molten solder [21] during reflow soldering; after solidification, the Cu atoms will diffuse into solidified solder from the Cu substrate, and based on screw dislocation mechanism, a long hollow will appear in the Cu6Sn5 whisker.…”

Section: Methodsmentioning

confidence: 62%

Cu<sub>6</sub>Sn<sub>5</sub> Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer

Zhang¹,

Liu²,

Yang³

et al. 2017

Preprint

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Cu6Sn5 whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag3Sn fibers can be observed around Cu6Sn5 whiskers in the matrix microstructure, which can play an active effect on the reliability of interconnection. Different morphologies of Cu6Sn5 whiskers can be observed, and hexagonal rod structure is the main morphology of Cu6Sn5 whiskers. A hollow structure can be observed in hexagonal Cu6Sn5 whiskers, and a screw dislocation mechanism was used to represent the Cu6Sn5 growth. Based on mechanical property testing and finite element simulation, Cu6Sn5 whiskers were regarded as having a negative effect on the durability of Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer.

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Influence of cooling speed on the solidification of a hyper‐eutectic CuSn alloy

Cited by 7 publications

References 28 publications

Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review

Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review

Investigation of Thermal Parameters Effects on the Microstructure, Microhardness and Microsegregation of Cu-Sn alloy Directionally Solidified under Transient Heat Flow Conditions

Cu<sub>6</sub>Sn<sub>5</sub> Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer

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