Effects of sputtering induced artifacts on the determination of diffusion coefficient: Application to Ni/Cu system

Lian, Songyou; Fourie, Antonie J.; Wang, Jiangyong; Swart, H.C.; Terblans, J.J.

doi:10.1016/j.vacuum.2022.111206

Cited by 3 publications

(1 citation statement)

References 53 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…According to the results obtained, both diffusion coefficients are in the range 10 −17 -10 −18 cm 2 /s, but Cu in Ni diffusivity coefficient is higher than the Ni in Cu one. In order of magnitude, our data are in good agreement with the data reported by Lian et al [46], where the Hall-Morabito method was also applied. Moreover, the authors proved that this method has good accuracy for the case of thin films and the influence of sputtering artefacts can be neglected.…”

Section: Discussionsupporting

confidence: 92%

Thermal and Ion Treatment Effect on Nanoscale Thin Films Scratch Resistance

Yanchuk¹,

Kruhlov²,

Закиев³

et al. 2022

Metallofiz. Noveishie Tekhnol.

View full text Add to dashboard Cite

In this study, a microtribological characteristics of Ni(25 nm)/Cu(25 nm)/ Cr(25 nm) three-layer thin films fabricated using DC magnetron sputtering are explored using progressive scratch test. Four various types of thin films are examined and compared: as-deposited film, film after low-energy Ar + ion irradiation, film annealed at 450°С for 15 minutes in vacuum, and film after ion irradiation followed by vacuum annealing. Scratch tests are supplemented by structural (XRD) and chemical (AES) experimental studies. As figured out, the sample after ion irradiation followed by annealing demonstrated the best microtribological and wear resistance characteristics among all studied films. The highest scratch resistance, smooth scratch shape, the lowest value of peak tangential force as well as the absence of side cracks and film delamination are revealed for the sample after irradiation followed by annealing. The likely reasons of this behaviour are discussed.

show abstract

Section: Discussionsupporting

confidence: 92%