“…These images show that some of the CZTS layers, used for device fabrications, include void formations. In the CZTS literature, it is often reported that the voids at the Mo-CZTS interface, which are called Kirkendall voids, form due to the different interdiffusion velocities of Cu, Zn, and Sn elements [58,59]. From the SEM cross sections of devices shown in figure 11, the thicknesses of CdS buffer layers deposited for 90, 75, 60 and 45 min were measured as 140.0, 134.9, 102.5, and 75.5 nm for cells 1 to 4, respectively.…”