Effects of surface finishes and loading speeds on shear strength of Sn–3.0Ag–0.5Cu solder joints

Kim, Jae-Myeong; Jeong, Myung-Yung; Yoo, Sehoon; Lee, Chang-Woo; Park, Young-Bae

doi:10.1016/j.mee.2011.03.148

Cited by 31 publications

(10 citation statements)

References 12 publications

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“…Geometry effect on the torque of BGA solder joints Shear stiffness (k) can be defined as the ratio of the shear force (F) to the displacement (d) under the force, which is a measure of the resistance offered by an elastic body to deformation, as given in Eq. (5). Torque (M) is the tendency of a force to rotate an object about an axis, fulcrum or pivot.…”

Section: Geometry Effect On the Coefficient Of Stress State Of Bga Somentioning

confidence: 99%

“…Due to the coefficient of thermal expansion (CTE) mismatch among the chips, solder joints and substrates, BGA solder joints are mainly subjected to shear stresses in service [2]. Consequently, solder ball shear tests have been widely adopted to evaluate the solder ball attachment strength in BGA joint packages [3][4][5][6][7][8]. Although ball shear tests can be used to evaluate the attachment strength quickly and conveniently, it cannot reflect the size and geometry effects of BGA solder joints accurately, where there are two attachment interfaces.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints

Zhang

Zhou

et al. 2015

Microelectronics Reliability

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Section: Geometry Effect On the Coefficient Of Stress State Of Bga Somentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints

Zhang

Zhou

et al. 2015

Microelectronics Reliability

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“…It is known that large and coarse brittle IMCs in solder joints results in embrittled microstructure and could compromise the reliability of solder joints. [4][5][6][7] Several studies detailing the characterisation of the formation of the primary intermetallic in the Sn-Cu solder joints have been reported, such as those involving primary Cu 6 Sn 5 morphologies. The growth behaviour of primary Cu 6 Sn 5 crystal during solidification was detailed in a paper by Xian et al 8 who claimed that the morphology of the primary Cu 6 Sn 5 changed from faceted hexagonal rods to grooved rods, in-plane branched faceted crystals, and dendrites via alteration of the Cu content and cooling rates.…”

Section: Introductionmentioning

confidence: 99%

Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties

Amli

Salleh

Ramli

et al. 2020

Journal of Elec Materi

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This study examines factor(s) behind the formation of primary Cu 6 Sn 5 (in the bulk, rather than at the interface) in solder joints, even though solder alloys are hypoeutectic. To understand the contribution from copper (Cu) dissolution from the substrate a Cu-free alloy, tin-3.5 silver (Sn-3.5Ag), was used as a soldered-on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish substrates. Microstructure observations including in situ synchrotron were used to observe microstructure development real-time and confirm the time and location for nucleation of primary Cu 6 Sn 5 . High-speed shear tests were performed to determine the solder joint's strengths. The results confirm that Cu dissolution during soldering is responsible for the formation of primary Cu 6 Sn 5 . The ENIG finish prevented Cu dissolution and the formation of Cu 6 Sn 5 resulting in higher solder joint strength for the Sn-3.5Ag/ENIG solder joints. The findings can be used to understand the evolution of primary Cu 6 Sn 5 and how it can be suppressed to improve joint strength.

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“…Shear and pull tests for solder balls are widely adopted to evaluate the mechanical reliability of solder balls (Bang et al , 2009; Cheng et al , 2017; Chia et al , 2006; Kim et al , 2012). In the tests, substrate finishes and test conditions affect the strength of the interface between solder balls and a substrate.…”

Section: Introductionmentioning

confidence: 99%

Study on the strength of diameter-reducing solder balls by shear and pull tests

Yang

Wang

et al. 2019

SSMT

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Purpose The purpose of this paper is to study the variation of the mechanical strength and failure modes of solder balls with reducing diameters under conditions of multiple reflows. Design/methodology/approach The solder balls with diameters from 250 to 760 µm were mounted on the copper-clad laminate by 1-5 reflows. The strength of the solder balls was tested by the single ball shear test and pull test, respectively. The failure modes of tested samples were identified by combing morphologies of fracture surfaces and force-displacement curves. The stresses were revealed and the failure explanations were assisted by the finite element analysis for the shear test of single solder ball. Findings The average strength of a smaller solder ball (e.g. 250 µm in diameter) is higher than that of a larger one (e.g. 760 µm in diameter). The strength of smaller solder balls is more highly variable with multiple reflows than larger diameters balls, where the strength increased mostly with the number of reflows. According to load-displacement curves or fracture surface morphologies, the failure modes of solder ball in the shear and pull tests can be categorized into three kinds. Originality/value The strength of solder balls will not deteriorate when the diameter of solder ball is decreased with a reflow, but a smaller solder ball has a higher failure risk after multiple reflows. The failure modes for shear and pull tests can be identified quickly by the combination of force-displacement curves and the morphologies of fracture surfaces.

show abstract

Effects of surface finishes and loading speeds on shear strength of Sn–3.0Ag–0.5Cu solder joints

Cited by 31 publications

References 12 publications

Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints

Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints

Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties

Study on the strength of diameter-reducing solder balls by shear and pull tests

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