Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder

Chen, Wei; Liu, Yongchang; Gao, Zhiming; Wan, Jingbo; Ma, Changsheng

doi:10.1007/s11664-008-0586-1

Cited by 11 publications

(3 citation statements)

References 20 publications

(21 reference statements)

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“…In addition, the microhardness is also considered as one of the acceptable ways to find the mechanical properties of materials including electronic solder alloys (Wei et al , 2009). The microhardness of the solder is often connected to how the metallic material resists wearing or abrasion (Chen et al , 2016).…”

Section: Introductionmentioning

confidence: 99%

Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature

Aamir

Tolouei‐Rad

Din

et al. 2019

SSMT

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Purpose Tin-Silver-Copper is widely accepted as the best alternative to replace Tin-Lead solders in microelectronics packaging due to their acceptable properties. However, to overcome some of the shortcomings related to its microstructure and in turn, its mechanical properties at high temperature, the addition of different elements into Tin-Silver-Copper is important for investigations. The purpose of this paper is to analyse the effect of lanthanum doping on the microstructure, microhardness and tensile properties of Tin-Silver-Copper as a function of thermal aging time for 60, 120 and 180 h at a high temperature of 150°C and at high strain rates of 25, 35 and 45/s. Design/methodology/approach The microstructure of un-doped and Lanthanum-doped Tin-Silver-Copper after different thermal aging time is examined using scanning electron microscopy followed by digital image analyses using ImageJ. Brinell hardness is used to find out the microhardness properties. The tensile tests are performed using the universal testing machine. All the investigations are done after the above selected thermal aging time at high temperature. The tensile tests of the thermally aged specimens are further investigated at high strain rates of 25, 35 and 45/s. Findings According to the microstructural examination, Tin-Silver-Copper with 0.4 Wt.% Lanthanum is found to be more sensitive at high temperature as the aging time increases which resulted in coarse microstructure due to the non-uniform distribution of intermetallic compounds. Similarly, lower values of microhardness, yield strength and ultimate tensile strength come in favours of 0.4 Wt.% Lanthanum added Tin-Silver-Copper. Furthermore, when the thermally aged tensile specimen is tested at high strains, two trends in tensile curves of both the solder alloys are noted. The trends showed that yield strength and ultimate tensile strength increase as the strain rate increase and decrease when there is an increase in thermal aging. Originality/value The addition of higher supplement (0.4 Wt.%) of Lanthanum into Tin-Silver-Copper showed a lower hardness value, yield strength, ultimate tensile strength, ductility, toughness and fatigue in comparison to un-doped Tin-Silver-Copper at high temperature and at high strain rates. Finally, simplified material property models with minimum error are developed which will help when the actual test data are not available.

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Section: Introductionmentioning

confidence: 99%

Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature

Aamir

Tolouei‐Rad

Din

et al. 2019

SSMT

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“…Considering soldering performance, reliability, cost and resources, alloys from the Sn-Ag, Sn-Bi, Sn-Cu, Sn-Sb and Sn-Zn binary systems are regarded as the potential substitutes for Sn-Pb solder (Plumbridge, 2005; Wade et al , 2001; Suganuma and Kim, 2007). Moreover, a number of multi-component systems, such as Sn-Ag-Cu (Chen et al , 2015), Sn-Ag-Zn (Wei et al , 2008a, 2008b) , Sn-In-Bi (Noor et al , 2010) and Sn-Ag-Zn-In (Wei et al , 2008, 2008b), have also been developed. However, there are no candidate replacements of Sn-37Pb that offer all of its properties, performance and benefits.…”

Section: Introductionmentioning

confidence: 99%

Simulating surface tension of Sn-based lead free solder using an artificial neural network

2016

SSMT

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Purpose Because of the complexity of relationship between surface tension and its decisive factors, such as temperature, concentration, electronic density, molar atomic volume and electro-negativity, a reasonable predicting model of surface tension of Sn-based solder alloys has not been developed yet. The paper aims to address the surface tension issue that has to be considered if the new lead free solder will be applied for electronics. Design/methodology/approach Using an artificial neural network (ANN) model with back-propagation (BP) algorithm, the surface tension for Sn-based binary solder alloys was simulated, and the comparison between the simulating results and data from experiments and literatures was analyzed as well. In addition, the relationship between surface tension and its decisive factors would be discussed based on the ANN and orthogonal design methods. Findings It is shown that the predicting model of surface tension of Sn-based solder alloys is constructed according to the BP–ANN theory, and the predicted value from the BP–ANN is in excellent agreement with the experimental results. The surface tension of Sn-based solders is determined by five factors, i.e. temperature, concentration, electronic density, molar atomic volume and electro-negativity. Among of the factors, molar atomic volume is major factor, and the order of degree of influence on surface tension is molar atomic volume > electro-negativity > electronic > density > concentration > temperature. Moreover, a simply reasonable equation is proposed to estimate the surface tension for Sn-based solders. Originality/value The five decisive factors of surface tension for Sn-based binary solder alloys have been analyzed theoretically, and a reasonable model of surface tension for Sn-based binary solder alloys is proposed as well. It is shown that ANN theory will be applied well to simulate the surface tension of Sn-based lead free solder.

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“…Moreover, until now, changes in bulk solder mechanical properties have been demonstrated using monotonic tests [12][13][14][15][16], which is a good but insufficient indicator of the influence of thermal ageing on the cyclic mechanical behaviour of SnAgCu alloys. The objective of the present study was to evaluate the influence of thermal ageing on the cyclic mechanical behaviour of SnAgCu alloys.…”

Section: Introductionmentioning

confidence: 99%

Cyclic mechanical behaviour of Sn3.0Ag0.5Cu alloy under high temperature isothermal ageing

Dompierre

Aubin

Charkaluk

et al. 2011

Materials Science and Engineering: A

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Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder

Cited by 11 publications

References 20 publications

Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature

Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature

Simulating surface tension of Sn-based lead free solder using an artificial neural network

Cyclic mechanical behaviour of Sn3.0Ag0.5Cu alloy under high temperature isothermal ageing

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