Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints

Liquid-state interfacial reactions in Sn–Zn/Pd couples and phase equilibria of the Sn–Zn–Pd system at 260 °C

“…These complicated interfacial behaviors are an important issue for the solder joint reliability. When the solder joints are subjected to the subsequent thermal aging, excessive IMC formation may degrade the mechanical strength of solder joints due to the brittle nature of IMC [9].…”

Mechanical Alloying Effect on Structural, Thermal and Mechanical Properties of Sn-Bi Alloy

“…The alloy prepared at 6 h milling time has the grain size of 100 µm, lower than the starting grain size (120−140 µm). The remarkable microstructure obtained after annealing is due to the dissolution of the residual stress caused by MA [7].…”

Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods

“…The use of lead-free solders has become common in electronic packaging industry due to environmental considerations [1.2] Among various lead-free solders available, high-Ag-content Sn-Ag-Cu alloys such as Sn-4wt.% Ag-0.5wt.% Cu (SAC405) or Sn-3wt.% Ag-0.5wt.% Cu (SAC305) are considered the most promising replacement of Sn-Pb solders, and are widely used as lead-free solutions for BGA interconnects [3][4][5]. However, the high rigidity of the high-Ag-content Sn-Ag-Cu solder joints causes drop-induced failures for portable electronics during normal or excessive use conditions.…”