2001
DOI: 10.1016/s0921-5107(01)00698-5
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Effects of Ti and TiN underlayers on electromigration reliability of Al–Cu interconnects

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Cited by 9 publications
(4 citation statements)
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“…4(c) is affected by the condition of barrier metal layered on the Metal 1. However, because the low current density, 2 MA/cm 2 , calculated during this electromigration test and TiN layer under W via of this study can be robust 'blocking boundary' for Al atoms migration [29][30][31], we only focus on the second type of failure to analyze the reservoir effect on electromigration lifetime shown in Fig. 4(b).…”
Section: Resultsmentioning
confidence: 99%
“…4(c) is affected by the condition of barrier metal layered on the Metal 1. However, because the low current density, 2 MA/cm 2 , calculated during this electromigration test and TiN layer under W via of this study can be robust 'blocking boundary' for Al atoms migration [29][30][31], we only focus on the second type of failure to analyze the reservoir effect on electromigration lifetime shown in Fig. 4(b).…”
Section: Resultsmentioning
confidence: 99%
“…The formation of [111] preferentially oriented Cu texture has been identified as one of the methods for improving interconnect reliability, 1) which is based on the well-known empirical fact for Al interconnects. [2][3][4][5] This is because the highest electromigration resistance is obtained when the most closely packed (111) plane of Cu, as well as Al, as an fcc metal, is placed in the direction perpendicular to the current flow direction. In actual cases, Cu interconnects are formed on a diffusion barrier deposited on a field-insulating layer prepared by a Cu dual-damascene process.…”
Section: Introductionmentioning
confidence: 99%
“…Titanium nitride (TiN) thin films have attracted much attention for various applications such as solar control windows, 1,2) hard coatings, 3,4) and microelectronics. [5][6][7][8][9] The TiN thin films were usually deposited by sputtering, 1,2,[5][6][7][8][9][10][11][12][13][14][15][16][17][18][19] ion plating, 3,20,21) and chemical vapor deposition 5,22,23) for each application. In the glass window industry, magnetron sputtering should have a great advantage in forming uniform films in a large area of more than 1 m 2 .…”
Section: Introductionmentioning
confidence: 99%