Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30&amp;#x03BC;m-pitch solder micro bump interconnections

Huang, Shih-Wei; Zhan, Cheng; Huang, Yu-Wei; Lin, Yu-Min; Fan, Chia-Wen; Chung, Seungjun; Kao, Kuo‐Shu; Chang, Jung‐Wei; Wu, Mei-Lun; Yang, Tsun-Hua; Lau, John H.; Chen, Tai-Hung

doi:10.1109/ectc.2012.6249001

Cited by 11 publications

(4 citation statements)

References 13 publications

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“…Recently, improvement of reliability performance in electroless Ni/Au metal finish by an additive metal layer of Palladium has been proposed [8,9]. In our previous study, we had discussed the effect of solder bump structure on the reliability response of solder micro bump interconnections [10]. Therefore, effect of under bump metallization fabricated by different plating techniques on the reliability of solder micro bump joints deserved to be considered.…”

Section: Introductionmentioning

confidence: 99%

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

Juang

Huang

Zhan

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

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Recently, three dimensional integration circuits technology has received much attention because of the demands of gradually increasing functionality and performance in microelectronic packaging for different types of electronic devices. For 3D chip stacking, high density interconnections are required in high-performance electronic products. Though the bumping process used could be either electroplating or electro-less plating for fine pitch solder micro bumps, its process effect on the reliability performances of micro joints still needs to be clarified from the microstructural point of view, especially for the fine pitch solder micro bump interconnections. In this study, we discussed the effect of Ni/Au metal finishing fabricated by electro-and electro-less plating on the reliability properties of 30m-pitch lead-free solder micro interconnections. Palladium layer was chosen to evaluate its influence on the reliability response of fine-pitch solder micro joints with electro-less Ni/Au surface finishing.The chip-to-chip test vehicle having more than 3000 solder micro bumps with a bump pitch of 30m was used in this study. Two types of metal finishing, electroplating Ni/Au and electro-less plating Ni/Pd/Au, were chosen and fabricated on the silicon carrier. In silicon carrier, the thickness of Ni layer was 2~3m while that of electroplating and electro-less plating Au layer was 0.5m and 0.02m respectively. The thickness of Pd layer within the electroless Ni/Pd/Au structure was 0.05~0.1m. The silicon chip with a solder micro bump structure of Cu/Ni/SnAg having a thickness of 5m/3m/5m was used for C2C bonding. We adopted the fluxless thermocompression process for both types of micro joints and then the chip stack was assembled by capillary-type underfill. Temperature cycling test (TCT) and electromigration test (EM) were conducted to assess the effect of metal finishing on the reliability properties of those solder micro bump interconnections.The reliability results revealed that the thickness of Au layer would apparently influence the microstructure evolution within the solder micro bump interconnection after bonding process though the micro joints with thick Au layer could pass the 1000 cycles TCT. The micro joints with complicated interface reaction resulted from the thicker Au layer might lead a negative effect on the long-term reliability properties while the Pd layer would enhance the wetting ability of solder micro bump during joining. The results of EM reliability test displayed that both types of the micro joints had excellent electromigration resistance under the testing condition of 0.08A/150C. The activated IMC growth within the micro joint during EM testing was the major reason for this superior property. This investigated completely presented the effect of metal finishing by electro-and electroless bumping processes on the reliability properties of fine pitch solder micro bump joints.

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Section: Introductionmentioning

confidence: 99%

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

Juang

Huang

Zhan

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

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“…The (Cu,Au) 6 Sn 5 and Cu 3 Sn phases, which formed on the top side of Cu UBM. The others might be (Cu,Au) x Sn y and (Cu,Ni,Au) x Sn y phases located upon the Cu/Ni/Au UBM [12]. The bonded samples, as shown in Figure 5, were then conducted with quality check and reliability test.…”

Section: Reliability Testmentioning

confidence: 99%

The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)

Juang

Chung

et al. 2012

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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In this study, various micro-bump-bonded structures with TCB + NCP processes were evaluated and developed. A commercial available snap-cure NCP material was applied for the joining processes study. Three types of micro bumps, Cu/Ni/Sn2.5Ag, Cu/Sn2.5Ag and Cu/Ni/Au-were fabricated and bonded to achieve joint structures of Cu/Ni/Sn2.5Ag/Ni/Cu, Cu/Ni/Sn2.5Ag/Au/Ni/Cu and Cu/Sn2.5Ag/Au/Ni/Cu. Moreover, the filler trapped and void issues which associated with the TCB+NCP process were also investigated. After the evaluation, the reliability test such as moisture sensitivity test level 3 (MSL 3), temperature cycling test (TCT) and high temperature Storage (HTS) were conducted to the bonded samples. Hereafter, the failure modes with the mentioned issues were analyzed and discussed.Based on the experimental and reliability results, the optimized TCB + NCP processes with various micro-bump-bonded structures can be established. The joints electrical and reliability performance associated with the failure mode were investigated and analyzed. Finally, the characteristics of each joint connection were defined.

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“…In most approaches, pillar bump on one chip is bonded to copper pillar bump, Cu, CuNiAu, or NiAu pad on the other chip or interposer. [2][3][4][5][6][7][8][9][10] As the vertical interconnect pitch gets finer, pillar bump has to be made smaller and the solder cap thickness has to be reduced. As a result, solder volume becomes less in the joint, and the role played by the intermetallic compound (IMC) gets more pronounced, and the joint becomes more brittle.…”

Section: Introductionmentioning

confidence: 99%

“…[2][3][4][5][6][7][8][9][10] Amount of solder volume in the joint has been maximized using gap control technique in thermocompression bonding, or by a local reflow process. To avoid the use of flux, plasma or argon sputter treatment has been studied to remove oxide on the solder surface prior to bonding.…”

Section: Introductionmentioning

confidence: 99%

Three dimensional interconnect using Au and pillar bumps

Kuo

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

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Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Abstract: With the increased demand of functionality in electronic device, three dimensional integration circuits technology

Cited by 11 publications

References 13 publications

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)

Three dimensional interconnect using Au and pillar bumps

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Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30&#x03BC;m-pitch solder micro bump interconnections

Abstract: With the increased demand of functionality in electronic device, three dimensional integration circuits technology

Cited by 11 publications

References 13 publications

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30&#x03BC;m-pitch solder micro bump interconnection

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30&#x03BC;m-pitch solder micro bump interconnection

The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)

Three dimensional interconnect using Au and pillar bumps

Contact Info

Product

Resources

About

Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection