Effects of zinc on the interfacial reactions of tin–indium solder joints with copper

Lin, Shih‐kang; Chang, Ru Bo; Chen, Sinn Wen; Tsai, Ming-Hui; Hsu, Chia Ming

doi:10.1007/s10853-014-8092-8

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Effects of zinc on the interfacial reactions of tin–indium solder joints with copper

Cited by 8 publications

References 19 publications

Effect of ZnO nanoparticle addition on the wettability, microstructure and mechanical properties of In-45.6Sn-5Bi low temperature solder

Effect of ZnO nanoparticle addition on the wettability, microstructure and mechanical properties of In-45.6Sn-5Bi low temperature solder

Effect of Zinc Addition on the Microstructure, Thermal and Mechanical Properties of Indium-Tin-xZinc Alloys

Effect of Zinc Addition on the Evolution of Interfacial Intermetallic Phases at Near-Eutectic 50In-50Sn/Cu Interfaces

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