2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) 2012
DOI: 10.1109/edaps.2012.6469416
|View full text |Cite
|
Sign up to set email alerts
|

Efficacy of port and lane staggering in reducing IO power supply noise

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
5
0

Year Published

2015
2015
2023
2023

Publication Types

Select...
2
1

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(5 citation statements)
references
References 1 publication
0
5
0
Order By: Relevance
“…If C BST is relatively large for integration in a chip in the design, it should be implemented on a package like the passive elements L and C OUT , which is a standard manner in IVR. [5][6][7]…”
Section: Simulation Results and Discussionmentioning
confidence: 99%
See 4 more Smart Citations
“…If C BST is relatively large for integration in a chip in the design, it should be implemented on a package like the passive elements L and C OUT , which is a standard manner in IVR. [5][6][7]…”
Section: Simulation Results and Discussionmentioning
confidence: 99%
“…Passive components such as the inductor, decoupling capacitor, and bootstrap capacitor are assumed to be utilized on the package, which is similar to the conventional IVR. [5][6][7] The cascode bridge circuit in the proposed IVR is composed of an HS NMOS power switch (M1, M2) and an LS NMOS power switch (M3, M4). Different from the conventional IVR with planar MOSFETs, the body is not connected to the source because there is no need to vary the potential during switching operation in a vertical BC MOSFET.…”
Section: Concept Of the Proposed Ivrmentioning
confidence: 99%
See 3 more Smart Citations