Efficient diffusion barrier layers for the catalytic growth of carbon nanotubes on copper substrates

García-Céspedes, J.; Thomasson, Sebastien B.; Teo, K. B. K.; Kinloch, Ian A.; Milne, W. I.; Pascual, E.; Bertrán, E.

doi:10.1016/j.carbon.2008.10.045

Cited by 69 publications

(40 citation statements)

References 29 publications

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“…1, were produced using a chemical vapour deposition (CVD) process. A liquid solution of ferrocene in toluene (8.76 wt%) was injected at a rate of 0.4 ml/min into a carrier gas preheated at 200°C [31]. The carrier gases used in this study were argon and hydrogen, at slightly above atmospheric pressure.…”

Section: Methodsmentioning

confidence: 99%

The effect of carbon nanotubes on the fracture toughness and fatigue performance of a thermosetting epoxy polymer

et al. 2011

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Multi-walled carbon nanotubes, with a typical length of 140 lm and a diameter of 120 nm, have been used to modify an anhydride-cured epoxy polymer. The modulus, fracture energy and the fatigue performance of the modified polymers have been investigated. Microscopy showed that these long nanotubes were agglomerated, and that increasing the nanotube content increased the severity of the agglomeration. The addition of nanotubes increased the modulus of the epoxy, but the glass transition temperature was unaffected. The measured fracture energy was also increased, from 133 to 223 J/m 2 with the addition of 0.5 wt% of nanotubes. The addition of the carbon nanotubes also resulted in an increase in the fatigue performance. The threshold strain-energy release-rate, G th , increased from 24 J/m 2 for the unmodified material to 73 J/m 2 for the epoxy with 0.5 wt% of nanotubes. Electron microscopy of the fracture surfaces showed clear evidence of nanotube debonding and pull-out, plus void growth around the nanotubes, in both the fracture and fatigue tests. The modelling study showed that the modified Halpin-Tsai equation can fit very well with the measured values of the Young's modulus, when the orientation and agglomeration of the nanotubes are considered. The fracture energy of the nanotube-modified epoxies was predicted, by considering the contributions of the toughening mechanisms of nanotube debonding, nanotube pull-out and plastic void growth of the epoxy. This indicated that debonding and pull-out contribute to the toughening effect, but the contribution of void growth is not significant. There was excellent agreement between the predictions and the experimental results.

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Section: Methodsmentioning

confidence: 99%

The effect of carbon nanotubes on the fracture toughness and fatigue performance of a thermosetting epoxy polymer

et al. 2011

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“…It is observed from the SEM images in Figure 5(a) that the substrate surface was lacking the catalytic nanoparticles. The disappearance of catalytic nanoparticles could be discussed by the fact that the catalysts may diffuse into the oxide layer on the surface of Cu substrate during the CVD process [11,23]. In contrast, the higher density of catalytic nanoparticles can be observed in Figure 5(b).…”

Section: Resultsmentioning

confidence: 97%

Buffer Film Assisted Growth of Dense MWCNTs on Copper Foils for Flexible Electrochemical Applications

Pakdee

Duangsawat

2017

Journal of Nanomaterials

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The novel Inconel buffer films were prepared on copper foils using unbalance direct current (DC) magnetron sputtering. These films were employed as buffer layers for supporting the dense growth of multiwalled carbon nanotubes (MWCNTs). Thermal chemical vapor deposition (CVD) with metal alloys such as stainless steel (SS) type 304 films was considered to synthesize MWCNTs. To understand the effectiveness of these buffer films, the MWCNTs grown on buffer-free layer were carried out as a comparison. The main problem such as the diffusion of catalysts into the oxide layer of metal substrate during the CVD process was solved together with a creation of good electrical contact between substrate and nanotubes. The morphologies, crystallinities, and electrochemical behaviors of MWCNTs grown on Inconel buffer films with 304 SS catalysts revealed the better results for applying in flexible electrochemical applications.

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“…Next, lithography patterning is performed to create the opening for the depositing of Au or Cu metallization by e-beam evaporation. After the first metallization is completed, a second lithography step is performed for the catalyst (used for CNT growth) and its barrier layer required for CNT growth [12][13][14]. The final 4″ wafer is then diced using a dicing machine and is ready for the growth of CNT.…”

Section: Design and Fabrication Of Flip Chip Structure For High-frequmentioning

confidence: 99%

Designing Carbon Nanotube Interconnects for Radio Frequency Applications

Brun

Yap

Baillargeat

et al. 2015

Nanopackaging: From Nanomaterials to the Atomic Scale

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With the blooming demand for wireless and mobile applications, the needs to develop existing RF technologies are increasing. For example, there is a need for RF technologies that can operate at much higher frequencies, which can be potentially used for satellite or tetra-hertz imaging applications. Thus, there is a strong interest for novel materials, which can have more reliable and stable high-frequency performance. Flip chip is one of the technology offering lower insertion loss, compact packages, and low-cost fabrication. The use of carbon nanotube (CNT) bumps to replace existing materials or applications is not unheard of. In this chapter, demonstration of a successfully CNT flip chip device at high frequency will be done. A parametric study using hybrid EM/analytical modeling of the device will be conducted.

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Efficient diffusion barrier layers for the catalytic growth of carbon nanotubes on copper substrates

Cited by 69 publications

References 29 publications

The effect of carbon nanotubes on the fracture toughness and fatigue performance of a thermosetting epoxy polymer

The effect of carbon nanotubes on the fracture toughness and fatigue performance of a thermosetting epoxy polymer

Buffer Film Assisted Growth of Dense MWCNTs on Copper Foils for Flexible Electrochemical Applications

Designing Carbon Nanotube Interconnects for Radio Frequency Applications

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