Through-focus scanning optical microscopy (TSOM) shows promise for
patterned defect analysis, but it is important to minimize total system noise.
TSOM is a three-dimensional shape metrology method that can achieve
sub-nanometer measurement sensitivity by analyzing sets of images acquired
through-focus using a conventional optical microscope. Here we present a
systematic noise-analysis study for optimizing data collection and data
processing parameters for TSOM and then demonstrate how the optimized parameters
affect defect analysis. We show that the best balance between signal-to-noise
performance and acquisition time can be achieved by judicious spatial averaging.
Correct background-signal subtraction of the imaging-system inhomogeneities is
also critical, as well as careful alignment of the constituent images used in
differential TSOM analysis.