Optimizing noise for defect analysis with through-focus scanning optical microscopy

Attota, Ravikiran; Kramar, John A.

doi:10.1117/12.2220679

Cited by 8 publications

(6 citation statements)

References 34 publications

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“…If the two TSOM images are obtained using two targets with slightly different dimensions, then the D-TSOM image color pattern highlights the type of dimensional difference between the two targets [10, 19, 22]. If the two TSOM images are obtained using the same target (similar to the repeated collection), then the D-TSOM image highlights noise [10, 17, 53], including optical and vibrational noise. Here we use the later method for noise analysis by quantifying the residual optical content in the D-TSOM image.…”

Section: Tsom Imaging Methodsmentioning

confidence: 99%

Fidelity test for through-focus or volumetric type of optical imaging methods

Attota¹

2018

Opt. Express

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Rapid increase in interest and applications of through-focus (TF) or volumetric type of optical imaging in biology and other areas has resulted in the development of several TF image collection methods. Achieving quantitative results from images requires standardization and optimization of image acquisition protocols. Several standardization protocols are available for conventional optical microscopy where a best-focus image is used, but to date, rigorous testing protocols do not exist for TF optical imaging. In this paper, we present a method to determine the fidelity of the TF optical data using the TF scanning optical microscopy images.

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Section: Tsom Imaging Methodsmentioning

confidence: 99%

Fidelity test for through-focus or volumetric type of optical imaging methods

Attota¹

2018

Opt. Express

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“…It is known that the sensitivity of TSOM can be enhanced by optimizing the INA and CNA [3]. A decrease in INA leads to an interference or diffraction optical signal in TSOM images [5,[11][12][13][14] due to increased optical coherence of the illuminating field. However, the influence of the degree of coherence has not been well studied and remains an unexplored research topic.…”

Section: Fmm Modeling Of Tsom Under Finite Na Incoherent Illuminationmentioning

confidence: 99%

Through-focus scanning optical microscopy with the Fourier modal method

Park¹,

Park²,

Kim³

et al. 2018

Opt. Express

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We propose a Fourier modal method (FMM) based through-focus scanning optical microscopy (TSOM) featuring sub-nano scale measurement tolerance. TSOM is very recently conceptualized non-destructive optical metrology technique just at the beginning stage of research. Nowadays the reliability and feasibility of TSOM concept is subject to controversy. We experimentally demonstrate stable nano-scale metrology of the FMM-based TSOM for the verification of the TSOM metrology and provide a numerical tool for true nano-meter scale TSOM through devising the FMM based TSOM scheme. By considering the illumination light parameters of incidence angle, polarization, degree of coherence, illumination numerical aperture, and collection numerical apertures in the FMM modeling of TSOM image acquisition, we reach precise agreement between the calculated and experimentally measured TSOM images. The essential elements of the FMM based TSOM for achieving high-level consistency are elucidated.

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“…This is the reason why the depth-scanning technique may enable reference-free inspection of systematic defects (i.e. no reference die), especially for the defect inspection for memory arrays [36]. Post-processing algorithms, which play the role of extracting defect information from raw optical images, are also critical because defect inspection is essentially a problem of SNR and contrast.…”

Section: Introductionmentioning

confidence: 99%

Optical wafer defect inspection at the 10 nm technology node and beyond

Zhu¹,

Liu²,

Xu³

et al. 2022

Int. J. Extrem. Manuf.

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The growing demand for electronic devices, smart devices, and the Internet of Things constitutes the primary driving force for marching down the path of decreased critical dimension and increased circuit intricacy of integrated circuits. However, as sub-10 nm high-volume manufacturing is becoming the mainstream, there is greater awareness that defects introduced by original equipment manufacturer components impact yield and manufacturing costs. The identification, positioning, and classification of these defects, including random particles and systematic defects, are becoming more and more challenging at the 10 nm node and beyond. Very recently, the combination of conventional optical defect inspection with emerging techniques such as nanophotonics, optical vortices, computational imaging, quantitative phase imaging, and deep learning is giving the field a new possibility. Hence, it is extremely necessary to make a thorough review for disclosing new perspectives and exciting trends, on the foundation of former great reviews in the field of defect inspection methods. In this article, we give a comprehensive review of the emerging topics in the past decade with a focus on three specific areas: (1) the defect detectability evaluation, (2) the diverse optical inspection systems, and (3) the post-processing algorithms. We hope, this work can be of importance to both new entrants in the field and people who are seeking to use it in interdisciplinary work.

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Optimizing noise for defect analysis with through-focus scanning optical microscopy

Cited by 8 publications

References 34 publications

Fidelity test for through-focus or volumetric type of optical imaging methods

Fidelity test for through-focus or volumetric type of optical imaging methods

Through-focus scanning optical microscopy with the Fourier modal method

Optical wafer defect inspection at the 10 nm technology node and beyond

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