Efficient System Architecture in the Era of Monolithic 3D

Abstract

Emerging Monolithic Three-Dimensional (M3D) integration technology will not only provide improved circuit density through the high-bandwidth coupling of multiple vertically-stacked layers, but it can also provide new architectural opportunities for on-chip computation, memory, and communication that are beyond the capabilities of existing process and packaging technologies. For example, with massive parallel communication between heterogeneous memory and compute layers, existing processing-in-memory architectures can be optimized and expanded, developing into efficient and flexible near-data processors. Additionally, multiple tiers of interconnect can be dynamically leveraged to provide an efficient, scalable interconnect fabric that spans the three-dimensional system. This work explores some of the challenges and opportunities presented by M3D technology for emerging computer architectures, with focus on improving efficiency and increasing system flexibility.

Impact of Temperature on Structure Deformation for Monolithic Inter-Tier vias In Monolithic 3D IC Packaging System

“…It is conceived that these methods are apt for nanofabrication of devices. The significant advantages of heterogeneous integration, modular design, reduced die size, power, cost and logic redundancy in M3D IC provides an attractive path towards many market segments such as logic (3D CMOS, 3D FPGA, 3D Gate Array), [13][14][15] memory (3D DRAM, 3D RRAM, 3D Flash), 16,17 optoelectronics, 18,19 deep neural networks 20,21 and hardware security. 22,23 The typical TSV based 3D ICs incorporate parallel integration in which the wafers are processed separately and then connected.…”