Efficient transient thermal analysis of chiplet heterogeneous integration

Nie, Chuanjun; Xu, Qinzhi; Wang, Chenghan; He, Chun; Liu, Jianyun; Li, Zhiqiang

doi:10.1016/j.applthermaleng.2023.120609

Cited by 10 publications

(2 citation statements)

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“…Cost and yield tradeoff of chiplet and monolithic chip integration were analyzed with possibly uncertain parameters; the results show that the overall cost of chiplet design is lower than that of the monolithic chip in five-year business planning [ 31 ]. The integrated fan-out (FO) on substrate solution was demonstrated by TSMC to achieve advanced chiplet integration; the mechanical reliability and fatigue risk of the present vehicle under temperature and humidity tests were assessed [ 32 , 33 , 34 ].…”

Section: Introductionmentioning

confidence: 99%

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Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

et al. 2023

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The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and deactivation technique in finite element analysis architecture. The submodeling technique is also utilized to mostly conquer the scale mismatch and difficulty in mesh gridding design. It is also used to analyze the thermomechanical responses of glass interposers with chiplet arrangements and capped epoxy molding compounds (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters for stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of the glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling.

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Section: Introductionmentioning

confidence: 99%

“…Micromachines 2023, 14, x FOR PEER REVIEW 3 of 15 mechanical reliability and fatigue risk of the present vehicle under temperature and humidity tests were assessed [32][33][34].…”

Section: Introductionmentioning

confidence: 99%