Electric charge influence on the metastable phase nucleation

Sokołowski, M.; Sokołowska, A.

doi:10.1016/0022-0248(82)90265-2

Cited by 48 publications

(12 citation statements)

References 12 publications

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“…The Impulse Plasma Deposition (IPD) method of surface engineering has been developed [1,2] in the Faculty of Materials Science of Warsaw University of Technology in the early 1980s. The principle of IPD was based on the nucleation on plasma ions, when potential energy of homogeneously generated nuclei was due to inelastic collisions with electrons.…”

Section: Introductionmentioning

confidence: 99%

Computational Studies of the Impulse Plasma Deposition Method

Rabiński¹,

Zdunek²

2016

Plasma Science and Technology - Progress in Physical States and Chemical Reactions

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During the Impulse Plasma Deposition (IPD), plasma is generated in the working gas due to a high-voltage high-current discharge ignited within an inter-electrode region of a coaxial accelerator. The paper presents computational studies of working medium dynamics during the IPD discharge. The plasma has been investigated with a two-dimensional mono-fluidic snow plow model and a two-dimensional two-fluid magnetohydrodynamic code. Computational studies of plasma dynamics have shown the function of the snow plow mechanism during the acceleration of plasma discharge, the role of the Rayleigh-Taylor instability, and the details of a sophisticated structure of a plasmoid in the region of the electrodes' front head. Simulations have significantly increased the understanding of the phenomena during the IPD; they also pointed to optimization directions. Several recent developments in the IPD surface engineering have been suggested and supported by the presented computational investigations.

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Section: Introductionmentioning

confidence: 99%

Computational Studies of the Impulse Plasma Deposition Method

Rabiński¹,

Zdunek²

2016

Plasma Science and Technology - Progress in Physical States and Chemical Reactions

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“…The impulse plasma is generated at a specified frequency in the form of discrete plasmoids with a life‐time order of 100 µs. The consecutive plasmoids are ejected into the vacuum chamber toward the substrate at a velocity of about 104 m · s −1 8, 12…”

Section: Introductionmentioning

confidence: 99%

“…[6] The most characteristic feature of the IPD method is that the synthesis proceeds in the impulse plasma itself, with the participation of ions. [7,8] The IPD growth mechanism, originating from the uncompleted coalescence of the clusters delivered onto the cold surface of the substrate. [9] During the IPD process, the impulse plasma generated in a coaxial plasma accelerator is the only source of mass and energy during the entire deposition process.…”

Section: Introductionmentioning

confidence: 99%

Electric Characterization and Selective Etching of Aluminum Oxide

Firek

Szmidt

Nowakowska-Langier

et al. 2009

Plasma Processes & Polymers

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This work presents results of investigations of Al2O3 thin films, deposited on Si substrates by means of impulse plasma deposition (IPD). Round, aluminum (Al) electrodes were evaporated on the top of deposited layers. Thus, metal‐insulator‐semiconductor (MIS) structures were created with aluminum oxide thin films playing the role of the insulator. It enabled subsequent electrical of studied material. Al2O3 layers were selective etched in a buffer of hydrofluoric acid. The photoresist was used as a masking material. The influence of etching time on the photoresist mask, etching progress, and the state of exposed Si surface was subsequently studied and is discussed. Films' microstructure were additionally studied by scanning electron microscopy (SEM).

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“…During the impulse plasma deposition (IPD) process [1] plasma is generated within the working gas due to a high-voltage high-current discharge, ignited and accelerated within an interelectrode region of a coaxial accelerator [2,3]. System of two coaxial metal electrodes (a cylinder and a rod, insulated from one another by a ceramic material), in which the plasma is accelerated by the Lorentz force, is the most efficient solution for surface engineering.…”

Section: Introductionmentioning

confidence: 99%

Influence of Plasma Dynamics on Material Synthesis Product of IPD Process

Rabiński

Zdunek

1999

Acta Phys. Pol. A

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In the present work we discuss recent studies concerning plasma dynamics influence on the material synthesis product of the impulse plasma deposition process. Conditions favourable for evaluation of the Rayleigh-Taylor instability on the current sheet surface were found during the computational studies of plasma movement in the coaxial accelerator. Appearance of this phenomenon explains non-uniform phase composition and morphology of coatings. By modifying the design of the plasma accelerator, we succeeded in reducing substantially Rayleigh-Taylor instability and in obtaining -Al2O3 a coatings instead of common γ -Al2 O3.

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Electric charge influence on the metastable phase nucleation

Cited by 48 publications

References 12 publications

Computational Studies of the Impulse Plasma Deposition Method

Computational Studies of the Impulse Plasma Deposition Method

Electric Characterization and Selective Etching of Aluminum Oxide

Influence of Plasma Dynamics on Material Synthesis Product of IPD Process

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