Electric charge trapping, residual stresses and properties of ceramics after metal/ceramics bonding

Hattali, M.L.; Mesrati, N.; Tréheux, D.

doi:10.1016/j.jeurceramsoc.2011.10.025

Cited by 12 publications

(4 citation statements)

References 22 publications

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“…The Scanning Electron Microscope Mirror (SEMM) method is frequently employed in study of electrical properties (charge trapping/detrapping, flashover, and electric breakdown) of insulating material (polymers, ceramics, …) and it has much interest because of its importance in technology and industry [5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Modelling of electron trajectories inside SEM chamber concerning mirror effect phenomenon

Al-Obaidi¹,

Khaleel²

2019

IJP

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A computational investigation is carried out to describe the behaviour of reflected electrons upon a charged insulator sample and producing mirror effect images. A theoretical expression for the scanning electron path equation is derived concerning Rutherford scattering and some electrostatic aspects. The importance of the derived formula come from its correlation among some of the most important parameters that controls the mirror effect phenomena. These parameters, in fact, are the trapped charges, incident angle and the scanning potential which investigated by considering its influences on the incident electrons. A pervious experimental operation requirements are adopted for operating the introduced expression. However, the obtained results are almost encouraged for using the presented expression to simulate the electron trajectory in sense of mirror effect.

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Section: Introductionmentioning

confidence: 99%

Modelling of electron trajectories inside SEM chamber concerning mirror effect phenomenon

Al-Obaidi¹,

Khaleel²

2019

IJP

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“…The connection of ceramic and metal to obtain high-quality joints will achieve the optimization of the respective properties of ceramics and metals and combine the advantages of high hardness, high strength, and easy processing of metals [5]. Therefore, the application scope of engineered ceramics can be expanded [6,7], and reliable joints of ceramics and metals should be assessed for successful manufacturing.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Microstructure and Properties of Si3N4 Ceramics/Cu/304 Stainless Steel Brazed by Ti40Zr25B0.2Cu Amorphous Solder

Wang

Zou

et al. 2018

Materials

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Si3N4 ceramics and 304 stainless steel were brazed by Ti40Zr25B0.2Cu amorphous solder, and the interfacial microstructure of brazed joint Si3N4 ceramics/Ti40Zr25B0.2Cu/Cu/Ti40Zr25B0.2Cu/304 stainless steel was analyzed. The mechanical properties of the brazed joint were overtly affected by the brazing temperature and Cu foil thickness. The results revealed that the interface structure of the brazed joint might be 304 stainless steel/FeTi/Cu-Zr+Cu-Ti+Fe-Ti/Cu(s,s)/Cu-Zr+Cu-Ti+Fe-Ti/Ti-Si+Zr-Si/TiN/Si3N4 ceramics. The four-point bending strength of the brazed joint decreased sharply as the brazing temperature increased and reached a maximum of 76 MPa at 1223 K. Furthermore, as the Cu foil thickness was increased from 500 μm to 1000 μm, the joint strength rose to 90 MPa at 1223 K.

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“…Xin et al [6] revealed that a layer of titanium film plated on the surface of Al 2 O 3 would increase the strength of the soldered joint. Fan et al [7], Wang et al [8] and Hattali et al [9] measured the residual stress of the soldered structure with Al 2 O 3 ceramics and different materials such as Y-TZP and SiC ceramics. Niu [10] and Zhong [11] also performed relevant experiments on Kovar alloy.…”

Section: Introductionmentioning

confidence: 99%

Residual stress distribution of the soldered structure with Kovar alloy and Al2O3 ceramics

Gao¹,

Wang²,

Zhang³

et al. 2017

PAC

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Residual stress distribution in soldered structure of Kovar alloy and Al 2 O 3 ceramics was determined using XRD analyses. In order to measure the residual stress, position of the characteristic diffraction peak and stress constant were obtained using several versatile/advanced techniques after calibration. Residual stress of soldered structure was measured based on the diffraction patterns obtained for the distribution of residual stress in the soldered joint. Only diffraction peak at 149°for Kovar alloy and two diffraction peaks ranging from 140-170°for Al 2 O 3 ceramics were found to be appropriate for the residual stress determination. It was also confirmed that for Al 2 O 3 ceramics the XRD peak at 152°reflects the changes of stress more precisely than the one at 146°. The stress constant K of Kovar alloy and Al 2 O 3 ceramics was found to be −197 MPa/°and −654 MPa/°, respectively. After soldering, the maximum residual stress of the soldered joint of both materials developed at 1 mm from the soldering seam, and the values within 3 mm from the soldering seam are generally significant. Thus, it is important to pay attention to the area of 3 mm from the soldering seam in practical application.

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Electric charge trapping, residual stresses and properties of ceramics after metal/ceramics bonding

Cited by 12 publications

References 22 publications

Modelling of electron trajectories inside SEM chamber concerning mirror effect phenomenon

Modelling of electron trajectories inside SEM chamber concerning mirror effect phenomenon

Interfacial Microstructure and Properties of Si3N4 Ceramics/Cu/304 Stainless Steel Brazed by Ti40Zr25B0.2Cu Amorphous Solder

Residual stress distribution of the soldered structure with Kovar alloy and Al2O3 ceramics

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