Electric field and viscous fluid polarity effects on capillary-driven flow dynamics between parallel plates

Hassan, Rizwan Ul; Khalil, Shaheer Mohiuddin; Khan, Saeed Ahmed; Moon, Joonkyeong; Cho, Dae-Hyun; Byun, Doyoung

doi:10.1016/j.heliyon.2023.e16395

Cited by 4 publications

(1 citation statement)

References 67 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…where the electrowetting number η, also known as the electrical capillary number (Fallah & Fattahi 2022;Hassan et al 2023), is defined as…”

Section: Electrowetting Actuationmentioning

confidence: 99%

Droplet jumping by modulated electrowetting

Vo,

Tran

2023

J. Fluid Mech.

View full text Add to dashboard Cite

We investigate jumping of sessile droplets from a solid surface in ambient oil using modulated electrowetting actuation. We focus on the case in which the electrowetting effect is activated to cause droplet spreading and then deactivated exactly at the moment the droplet reaches its maximum deformation. By systematically varying the control parameters such as the droplet radius, liquid viscosity and applied voltage, we provide detailed characterisation of the resulting behaviours including a comprehensive phase diagram separating detachment from non-detachment behaviours, as well as how the detach velocity and detach time, i.e. duration leading to detachment, depend on the control parameters. We then construct a theoretical model predicting the detachment condition using energy conservation principles. We finally validate our theoretical analysis by experimental data obtained in the explored ranges of the control parameters.

show abstract

“…where the electrowetting number η, also known as the electrical capillary number (Fallah & Fattahi 2022;Hassan et al 2023), is defined as…”

Section: Electrowetting Actuationmentioning

confidence: 99%

Droplet jumping by modulated electrowetting

Vo,

Tran

2023

J. Fluid Mech.

View full text Add to dashboard Cite

show abstract

Recent Advancements in Fluid Dynamics: Drag Reduction, Lift Generation, Computational Fluid Dynamics, Turbulence Modelling, and Multiphase Flow

Wang,

Animasaun,

Muhammad

et al. 2024

Arab J Sci Eng

View full text Add to dashboard Cite

Experimental and numerical study of solder bumps impact on the underfill fluid flow under electrohydrodynamic effect

Hassan,

Khalil,

Khan

et al. 2023

Phys. Scr.

Self Cite

View full text Add to dashboard Cite

Solder bumps can increase filling time, which is one of the main challenges in electronic packaging reliability. Here, we compare the capillary flow behavior between parallel plates with and without solder bumps to examine how solder bumps affect the length of the underfill fluid flow under the effects of an electric potential. We found that the solder bumps restrained the flow length, while the electric field enhanced it. By enhancing the voltage from 0 to 1000 V, in the case without solder bumps, the flow length increased by up to 30%, and it increased by up to 25% in the case of solder bumps. To determine the optimum bump design, we selected the diameter and pitch size of the solder bumps as the independent variables. The results revealed that larger pitch sizes and smaller diameters show longer fluid flow lengths. The effect of the electric field on varying nozzle positions was also investigated. We found that the fluid flow length increased when the nozzle was between the solder bumps compared to the top of the solder bumps. According to our observations, the nozzle position is also the main factor in determining the fluid flow length compared with the bump diameter and pitch sizes for the design of the underfill packaging process. Numerical simulations were also performed to compare the experimental results, and the average discrepancy between the experimental and numerical results at various time steps for different solder bump parameters was between 5 to 10%. Our findings demonstrate the potential of using electric potential in conjunction with solder bumps to control underfill flow, which can benefit flip-chip packaging applications. Numerical methods can accurately predict underfill fluid flow with solder bumps under the electric field effect.

show abstract

Electric field and viscous fluid polarity effects on capillary-driven flow dynamics between parallel plates

Cited by 4 publications

References 67 publications

Droplet jumping by modulated electrowetting

Droplet jumping by modulated electrowetting

Recent Advancements in Fluid Dynamics: Drag Reduction, Lift Generation, Computational Fluid Dynamics, Turbulence Modelling, and Multiphase Flow

Experimental and numerical study of solder bumps impact on the underfill fluid flow under electrohydrodynamic effect

Contact Info

Product

Resources

About