2019
DOI: 10.7567/1882-0786/ab4934
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Electric-field-induced simultaneous diffusion of Mg and H in Mg-doped GaN prepared using ultra-high-pressure annealing

Abstract: To investigate Mg diffusion during ultra-high-pressure annealing, which activates Mg acceptors in GaN, GaN samples with p–n junctions prepared via epitaxial growth were annealed at 1573 K under 1 GPa. The profiles of Mg diffusion toward the underlying n-type layer cannot be explained by a simple diffusion model. We found that H atoms diffused along with Mg atoms. By considering the suppressed diffusion of positively charged interstitial H atoms due to the electric field in the depletion layer, we could better … Show more

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Cited by 32 publications
(31 citation statements)
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“…Figure 5 a,b shows the depth distributions of Mg and H measured by SIMS. The incorporation of H in the samples during UHPA was reported by Narita et al 12 . They suggested that unintentional moisture may exist in the UHPA chamber, and this caused doping of H into the sample during UHPA.…”
Section: Resultsmentioning
confidence: 60%
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“…Figure 5 a,b shows the depth distributions of Mg and H measured by SIMS. The incorporation of H in the samples during UHPA was reported by Narita et al 12 . They suggested that unintentional moisture may exist in the UHPA chamber, and this caused doping of H into the sample during UHPA.…”
Section: Resultsmentioning
confidence: 60%
“…The present samples were undoped GaN films with 2-µm-thickness grown by using metal-organic vapor phase deposition (MOVPE). Details on the sample preparation process and the electric properties of the samples after UHPA are given elsewhere 11,12 . Before the deposition of the top GaN film, a 0.2-μm-thick buffer layer (n + -GaN) was grown on c+-GaN substrates obtained by hydride vapor phase epitaxy (HVPE).…”
Section: Methodsmentioning
confidence: 99%
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“…Recently, very effective activation by ultra-high pressure annealing (UHPA) of magnesium (Mg)-implanted p-type GaN has been announced [4]. Investigation of Mg diffusion during the UHPA process also started [5]. Next to Mg, beryllium (Be) is one of the most promising acceptor dopants for GaN.…”
Section: Introductionmentioning
confidence: 99%
“…Although these results suggest that the UHPA process is a promising post-implantation process, several technical issues, such as the inclusion of impurities, costs, throughput, etc., must be overcome for industrial applications of UHPA. Thus, a subsequent ion implantation (or co-implantation) technique that is used before annealing at atmospheric pressure is also a potential candidate 16,17 .…”
mentioning
confidence: 99%