2017
DOI: 10.1007/s11837-017-2707-x
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Electrical and Mechanical Properties of 3D-Printed Graphene-Reinforced Epoxy

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Cited by 70 publications
(31 citation statements)
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“…DIW utilizes direct deposition of viscoelastic feedstock materials at ambient temperatures, enabling a wide range of materials to be independently or jointly deposited during a build to achieve specific structural or functional properties. [7,[9][10][11][12] A wide variety of powder-based inks can be formulated for DIW using powders, solvents, dispersants, viscosifying agents, and polymer binders, and the printing process is largely material-agnostic. [10,[13][14][15] Critical to the DIW process, ink feedstock formulations must exhibit the following rheological properties: 1) shear thinning to allow extrusion out of submillimeter diameter nozzles under ambient conditions without requiring excessive driving pressure, and 2) once deposited on the substrate, inks must possess a high shear storage modulus, G 0 , and shear yield strength, τ y , for shape retention.…”
Section: Introductionmentioning
confidence: 99%
“…DIW utilizes direct deposition of viscoelastic feedstock materials at ambient temperatures, enabling a wide range of materials to be independently or jointly deposited during a build to achieve specific structural or functional properties. [7,[9][10][11][12] A wide variety of powder-based inks can be formulated for DIW using powders, solvents, dispersants, viscosifying agents, and polymer binders, and the printing process is largely material-agnostic. [10,[13][14][15] Critical to the DIW process, ink feedstock formulations must exhibit the following rheological properties: 1) shear thinning to allow extrusion out of submillimeter diameter nozzles under ambient conditions without requiring excessive driving pressure, and 2) once deposited on the substrate, inks must possess a high shear storage modulus, G 0 , and shear yield strength, τ y , for shape retention.…”
Section: Introductionmentioning
confidence: 99%
“…Reprinted with permission from [117]. [124], which can be applied in Li-S batteries [125], biomedical smart nanomaterials [126] and gas sensors [85], etc. Furthermore, through synergistically leveraging the structural properties [127], biocompatibility [128], thermal and conductive properties of graphene-based materials [129], multifunctional ceramics can be effectively manufactured via DIW.…”
Section: Materials Extrusionmentioning
confidence: 99%
“…Polymers are suitable for the majority of AM technologies owing also to relatively low processing temperature compared to ceramic or metal matrices. A wide range of thermoplastic and thermoset polymers can be processed via AM, for instance PLA [155], PCL [156], ABS [110], PVA [157], polycarbonate urethane (PCU) [158], epoxy [124] and photosensitive resin [107]. Nanofillers like graphene and its derivatives are introduced into polymers to create high-performance nanocomposites with a high strength-to-weight ratio and additional multifunctional properties [159].…”
Section: Graphene-based Polymer Matrix Compositesmentioning
confidence: 99%
“…In particular, direct ink writing (DIW), a type of material extrusion additive manufacturing, allows precise patterning of viscoelastic feedstock materials at ambient temperatures to build structural and/or functional components in a layer-by-layer fashion. [8] A wide variety of feedstock inks have been formulated for DIW, allowing fabrication of a broad range of materials including polymers, [9][10][11][12] ceramics, [13][14][15] metals, [16][17][18] and composites. For example, epoxy-based composite feedstocks reinforced with silicon carbide whiskers, [19][20][21] nanoclay, [9] graphene, [12] and carbon fibers (CFs) [11,[22][23][24] have been explored recently to improve strength and stiffness in printed materials.…”
mentioning
confidence: 99%
“…[8] A wide variety of feedstock inks have been formulated for DIW, allowing fabrication of a broad range of materials including polymers, [9][10][11][12] ceramics, [13][14][15] metals, [16][17][18] and composites. For example, epoxy-based composite feedstocks reinforced with silicon carbide whiskers, [19][20][21] nanoclay, [9] graphene, [12] and carbon fibers (CFs) [11,[22][23][24] have been explored recently to improve strength and stiffness in printed materials. Further mechanical improvement can be realized by applying the C-S architecture to high stiffness CF inks coupled with low-density foam inks for the shell and core materials, respectively.Here, we report for the first time a new C-S printhead (Figure 1b) specifically designed to print highly loaded, fiberfilled inks, as well as a new low-density syntactic epoxy foam ink for use as a low-density core material in hybrid C-S architectures.…”
mentioning
confidence: 99%