Electrical and optical integration of a monolithic 1×12 array of InGaAsP/InP (λ=1.3-µm) light-emitting diodes

Twelve-channel individually addressable InGaAs/InP p-i-n photodiode and InGaAsP/InP LED arrays in a compact package

“…12(a> and (b), respectively. Using the lateral fiber-block, the package size has been reduced to 1.8L X 0.75W X 0.6H cm3, appreciably smaller than the previous normal coupling package [3]. Thermal performance of this package may be summarized as follows: the DIP header tempera- In the lateral fiber block, all fibers are secured with pre--16 cise spacing (250 pm) and the polished surface (see Fig. 2 ) provides a reference which is valuable for passive alignment schemes.…”

“…The array is bonded p-side down to a heat-spreading electrical fanout, the heat spreader is bonded to a 14-pin metal DIP header, and wire bonds are made between fanout and pins. The diode-tofiber alignment is done actively, similarly to the procedure previously reported [3]. Fig.…”

“…Previously, we reported the development of a monolithically integrated 1 X 12 array of InGaAs/InP p-i-n photodiodes sensitive to wavelengths between 0.95 and 1.65 pm [2], and of a 1 X 12 array of InGaAsP/InP light-emitting diodes (LED) emitting at 1.3 pm [3]. These arrays employed a ribbon pigtail containing twelve optical fibers to achieve input/output coupling with the fiber axes aligned normal to the diode active regions (normal coulpling).…”