Electrical and thermal conductivities in quenched and aged high-purity Cu–Ti alloys

Suzuki, Shigenobu

doi:10.1016/s1359-6462(02)00441-4

Cited by 84 publications

(24 citation statements)

References 6 publications

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“…26 Moreover, although carbon diffuses through TiC consuming Ti from the matrix, dissolution of Ti in the matrix may also occur. 27 All TiC grains are completely surrounded by the metal phase (Figure 2(e)), revealing the good wettability of Cu on TiC, as already observed by Sabatello et al 28 As the initial porosity decreased (from Figure 2(a) to (f)), the fraction of carbide and matrix phases and the continuity of these phases decreased, which would contribute for the decreasing in the electrical conductivity. Figure 3 shows the electrical resistivity in function of the fraction of remaining carbon in the composites.…”

Section: Methodssupporting

confidence: 71%

Conductive TiC/Ti–Cu/C composites fabricated by Ti–Cu alloy reactive infiltration into 3D-printed carbon performs

Rambo

Travitzky

Greil

2014

Journal of Composite Materials

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The microstructure and electrical properties of dense TiC/Ti-Cu/C composites fabricated by pressureless reactive infiltration of Ti-Cu alloy into porous starch-derived carbon preforms prepared by 3D printing was evaluated. Porosities in the range of 65-78 vol% were varied by post-isostatic pressing the as-printed preforms at pressures of 50-400 MPa. The reactive melt infiltration was carried out at 1100 C in a flowing Ar atmosphere and resulted in formation of a composite comprised predominantly of substoichiometric TiC, binary intermetallic Ti-Cu phases and residual carbon. Scanning electron microscopy analyses revealed a microstructure consisting of dispersed fine-grained TiC in a Ti-Cu matrix surrounded by a continuous carbon phase. Electrical resistivity measurements using the fourprobe method were carried out and correlated to the composite microstructure. The electrical resistivity was evaluated in terms of carbon and TiC volume fractions.

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Section: Methodssupporting

confidence: 71%

Conductive TiC/Ti–Cu/C composites fabricated by Ti–Cu alloy reactive infiltration into 3D-printed carbon performs

Rambo

Travitzky

Greil

2014

Journal of Composite Materials

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“…This could be due to the reason that Ti content not only in the solid solution of Cu, but also in α-Cu 4 Ti phase decreases effectively by aging in hydrogen atmosphere than that by aging in vacuum in forming Ti-hydrides. The hardness of the Cu-3at.%Ti alloy aged at 500°C for 1h in hydrogen atmosphere is the same as that aged in vacuum [14]. On the other hand, in the our previous study for Cu-3mass%Ti alloy, the nominal stress (1094MPa) of hydrogenated sample at 350°C is higher than that (908.8MPa) of aged sample in Ar-atmosphere.…”

Section: Introductionsupporting

confidence: 49%

Simultaneous Enhancement of Electrical Conductivities and Mechanical Properties in Cu-Ti Alloy by Hydrogenation Process

Kamegawa

Iwaki

Okada

2010

MSF

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Abstract. Effects of hydrogenation process of the microstructure, electrical conductivity and mechanical properties for the Cu-(1~3) mass%Ti alloys were investigated. During hydrogenation process at 350°C, 7.5 MPa for 48 h, the disproportionation reaction occurred with forming of Ti hydrides in the alloy. It is found that remarkable simultaneous improvements of mechanical strength of 1094 MPa and electrical properties of 21%IACS are obtained in the hydrogenated Cu-3mass%Ti alloy.

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“…With increasing the VGCFs content up to 0.1 mass%, the electrical conductivity of Cu-0.4Ti/XVGCFs composites increased continuously and dramatically to a value of 86.0 IACS% for Cu-0.4Ti/0.1VGCFs. Generally, pure copper or copper alloy based composites reinforced with carbon nano-particles such as VGCFs have lower electrical conductivity in comparison with the unreinforced materials due to the low wettability and reactivity between copper alloy matrix and nano-particles [6][7][8] . However, in the present work, the Cu-0.4Ti/0.1VGCFs fabricated via PM method and hot extrusion exhibited twice electrical conductivity comparing with monolithic Cu-0.4Ti alloy.…”

Section: Results and Dissectionsmentioning

confidence: 99%

Effect of Reaction between Alloying Element and VGCFs on Mechanical and Electrical Properties of PM Copper Alloy Composites Dispersed with VGCFs

et al. 2016

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In this research, the effect of alloying elements on the mechanical and electrical properties of powder metallurgy (PM) copper composite reinforced with vapor-grown carbon bers (VGCFs) was investigated. The alloying elements were titanium (Ti) and silicon (Si) that could easily form their carbides at elevated temperatures. The VGCFs-doped Cu-Ti composites showed a slightly decreased yield stress in comparison with the unadulterated Cu-Ti alloy. The electrical conductivity of the composite materials increased with increasing VGCFs content. However, the VGCFs-doped Cu-Si composites exhibited the same mechanical and electrical properties as the Cu-Si alloy. It was found that the reaction between Ti and VGCFs in forming TiC particles consumed the Ti solutes in the matrix and led to a reduction of solid solution strengthening effect by Ti elements, whereas the reaction between Si and VGCFs in forming SiC was observed. In addition, VGCFs adulteration showed no effect on the strength and conductivity improvement of Cu-Si alloy.

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Electrical and thermal conductivities in quenched and aged high-purity Cu–Ti alloys

Cited by 84 publications

References 6 publications

Conductive TiC/Ti–Cu/C composites fabricated by Ti–Cu alloy reactive infiltration into 3D-printed carbon performs

Conductive TiC/Ti–Cu/C composites fabricated by Ti–Cu alloy reactive infiltration into 3D-printed carbon performs

Simultaneous Enhancement of Electrical Conductivities and Mechanical Properties in Cu-Ti Alloy by Hydrogenation Process

Effect of Reaction between Alloying Element and VGCFs on Mechanical and Electrical Properties of PM Copper Alloy Composites Dispersed with VGCFs

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