Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

Lau, Fu Long; Made, Riko I; Putra, Wahyuaji Narottama; Lim, J. Z.; Nachiappan, Vivek Chidambaram; Aw, Jie Li; Gan, Chee Lip

doi:10.1016/j.microrel.2013.07.081

Cited by 11 publications

(4 citation statements)

References 14 publications

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“…Therefore, by reference to a number of binary diagrams and the research results of [18][19][20][21][22], a new Au-Ge solder was developed by addition of 1.5 wt % Ni and 0.5 wt % Cu into Au-10 wt % Ge. The role of Ni and Cu is mainly to promote the strength of the solder and its wettability to the Cu-Cr-Zr alloy.…”

Section: Properties Of the Au Based Soldermentioning

confidence: 99%

“…In addition, the reliability of the brazed joint under complex environments should be examined. As was studied in [21], the compatibility regarding electrical properties of the welding joint to the parent metals is important. In our experiments, compatibility of electrical resistance of the welding joint to the parent In the above experiment, the clearances between the sintered cylinder and the sleeve were controlled to be 0.002-0.004 mm at one side.…”

Section: Effect Of the Brazing With Side Solder Feedingmentioning

confidence: 99%

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Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

et al. 2017

Metals

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Au-Ge-Ni solder was chosen for brazing of the Cu-Cr-Zr alloy cylinder and a part with a cylindrical hole (sleeve) below 550 • C. The Au based solder was first sintered on the surface of the cylinder and then brazed to the inner surface of the sleeve. The effects of the heating process, the temperature and the holding time at the temperature on the microstructure of the sintered layer on the surface of the cylinder, the brazed interfacial microstructure, and the brazed shear strength between the cylinder and the sleeve were investigated by scanning electron microscope, energy dispersive X-ray spectroscopy analysis, and tensile shear tests. By approach of side solder melt feeding and brazing under proper parameters, the voids and micro cracks due to a lack of enough solder melt feeding are greatly lessened and the brazed shear strength of 100 MPa is ensured even with large clearances around 0.01 mm.

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Section: Properties Of the Au Based Soldermentioning

confidence: 99%

Section: Effect Of the Brazing With Side Solder Feedingmentioning

confidence: 99%

Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

et al. 2017

Metals

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“…With the increasing in power density of devices, the requirement of reliability in packaging technology becomes harsher. Conventional high-temperature solders, such as Zn-based [ 3 , 4 ] and Au-based [ 4 , 5 ], are difficult to meet the demand for the reliability of power devices under high-temperature operating conditions due to their own drawbacks. Thus, it is necessary to develop a new packaging technology to meet the requirements.…”

Section: Introductionmentioning

confidence: 99%

A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature

Yang

Meng

et al. 2021

Micromachines

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A novel bonding process using Ag agglomerates paste prepared by Ag2O reduction has been proposed, which solved the problem of Cu substrate oxidation in the conventional Ag2O sintering process for Cu–Cu bonding. By applying the Ag agglomerate paste to Ag–Ag bonding, a shear strength of 28.3 MPa at 150 °C was obtained. Further studies showed that the optimum sintering temperature was at 225 °C, and a shear strength of 46.4 MPa was obtained. In addition, a shear strength of 20 MPa was obtained at 225 °C for Cu–Cu bonding. Compared to common Ag pastes, the results in this paper revealed that the sintering behavior of Ag agglomerates was unique, and the sintering mechanisms for Ag–Ag and Cu–Cu bonding were also discussed.

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“…Additionally, Au-12Ge alloy possesses many interesting properties such as excellent corrosion and oxidation resistance, thermal fatigue resistance, combined with high joint strength [12]. Therefore, Au-12Ge solder has been the critical packaging material for advanced microelectronic devices, especially the die attachment and micro-electro-mechanical systems (MEMS) devices package [13]. Furthermore, Au-12Ge alloy can meet the requirements of electrical conductivity and high reliability in high-power and high-integration applications, so it is especially suitable for connection of the silicon carbide power devices, microwave circuit and wafer bonding.…”

Section: Introductionmentioning

confidence: 99%

Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint

Wang

Xue

Long

et al. 2020

Metals

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Extreme temperature change has generally been the great challenge to spacecraft electronic components, particularly in long, periodic, deep-space exploration missions. Hence, researchers have paid more attention to the reliability of component packaging materials. In this study, the microstructure evolution on the interface of Cu/Ni/Au/Au-12Ge/Au/Ni/Cu joints, as well as the effects of extreme thermal shock on mechanical properties and the fracture mode in the course of extreme thermal changes between −196 and 150 °C, have been investigated. Results revealed that the interface layers comprised of two thin layers of NiGe and Ni5Ge3 compounds after Au-12Ge solder alloy was soldered on the Au/Ni/Cu substrate. After extreme thermal shock tests, the microstructure morphology converted from scallop type to planar one due to the translation from NiGe to Ni5Ge3. Meanwhile, the thickness of interface layer hardly changed. The shear strength of the joints after 300 cycles of extreme thermal shock was 35.1 MPa, which decreased by 19.61%. The fracture location changed from the solder to solder/NiGe interface, and then to the interface of NiGe/Ni5Ge3 IMC layer. Moreover, the fracture type of the joints gradually transformed from ductile fracture mode to brittle mode during thermal shock test. Simultaneously, the formation and extension of defects, such as micro-voids and micro-cracks, were found during the process of thermal shock due to the different thermal expansion coefficient among the solder, interface layer and substrate.

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Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

Cited by 11 publications

References 14 publications

Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature

Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint

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