Electrical characteristics and detailed interfacial structures of Ag/Ni metallization on polycrystalline thermoelectric SnSe

Kim, Yeongseon; Jin, Yufeng; Yoon, Giwan; Chung, In; Yoon, Hana; Yoo, Chung‐Yul; Sang, Hyun Park

doi:10.1016/j.jmst.2018.11.020

Cited by 18 publications

(6 citation statements)

References 24 publications

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“…Ag/Ni bilayer and Ag/Co/Ti multi-layer were developed as diffusion barriers [93,186]. For example, no secondary phases and no cracks were observed between the Ag/Co/Ti multi-layer and the SnSe interface [186]. Moreover, the specific contact resistance between the Ag/Co/Ti multi-layer and the SnSe was observed to be approximately 1.53 mΩ cm 2 at room temperature.…”

Section: (E) Other Modulesmentioning

confidence: 97%

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Thermoelectric power generation: from new materials to devices

Tan

Ohta

Kanatzidis

2019

Phil. Trans. R. Soc. A.

136

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Thermoelectric technology offers the opportunity of direct conversion between heat and electricity, and new and exciting materials that can enable this technology to deliver higher efficiencies have been developed in recent years. This mini-review covers the most promising advances in thermoelectric materials as they pertain to their potential in being implemented in devices and modules with an emphasis on thermoelectric power generation. Classified into three groups in terms of their operating temperature, the thermoelectric materials that are most likely to be used in future devices are briefly discussed. We summarize the state-of-the-art thermoelectric modules/devices, among which nanostructured PbTe modules are particularly highlighted. At the end, key issues and the possible strategies that can help thermoelectric power generation technology move forward are considered. This article is part of a discussion meeting issue ‘Energy materials for a low carbon future’.

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Section: (E) Other Modulesmentioning

confidence: 97%

“…The fabrication of a module based on polycrystalline SnSe has just begun. Ag/Ni bilayer and Ag/Co/Ti multi-layer were developed as diffusion barriers [93,186]. For example, no secondary phases and no cracks were observed between the Ag/Co/Ti multi-layer and the SnSe interface [186].…”

Section: (E) Other Modulesmentioning

confidence: 99%

Thermoelectric power generation: from new materials to devices

Tan

Ohta

Kanatzidis

2019

Phil. Trans. R. Soc. A.

136

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“…Table summaries the design methods and performance of state-of-the-art conventional thermoelectric modules with both double-leg and single-leg types (refs , , , , , , , , , , , , , , and − ), including ZT max and temperatures for both p-type and n-type legs, types of electrodes and designed interlayers for both hot and cold sides, selected substrates, and achieved P , η, and Δ T . Currently, the conventional devices are mostly based on Bi 2 Te 3 and Sb 2 Te 3 for low-temperature usages, PbTe and skutterudites for medium-temperature usages, and half-Heuslers for high-temperature usages.…”

Section: Device Designmentioning

confidence: 99%

Advanced Thermoelectric Design: From Materials and Structures to Devices

2020

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The long-standing popularity of thermoelectric materials has contributed to the creation of various thermoelectric devices and stimulated the development of strategies to improve their thermoelectric performance. In this review, we aim to comprehensively summarize the state-of-the-art strategies for the realization of high-performance thermoelectric materials and devices by establishing the links between synthesis, structural characteristics, properties, underlying chemistry and physics, including structural design (point defects, dislocations, interfaces, inclusions, and pores), multidimensional design (quantum dots/wires, nanoparticles, nanowires, nano-or microbelts, few-layered nanosheets, nano-or microplates, thin films, single crystals, and polycrystalline bulks), and advanced device design (thermoelectric modules, miniature generators and coolers, and flexible thermoelectric generators). The outline of each strategy starts with a concise presentation of their fundamentals and carefully selected examples. In the end, we point out the controversies, challenges, and outlooks toward the future development of thermoelectric materials and devices. Overall, this review will serve to help materials scientists, chemists, and physicists, particularly students and young researchers, in selecting suitable strategies for the improvement of thermoelectrics and potentially other relevant energy conversion technologies.

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“…7,9 A good diffusion barrier material for the TE joints generally needs to meet the following requirements: 6,7,9 matched coefficient of thermal expansion (CTE), high contact electrical and thermal conductivity, stabilized interdiffusion behaviors, high bonding strength, and excellent thermal and chemical stability. Therefore, metals and alloys are usually taken as diffusion barrier materials and electrodes for the TE joints, 6,7,9 such as Ni for SnSe 10 and Zn 4 Sb 3 , 11 Sn for GeTe, 12 Au for Cu 26 Nb 2 Ge 6 S 32 , 13 Cu for Mg 2 Si, 14 and PbTe, 15 Ti for Bi 2 Te 3 16 and CoSb 3 , 17 Nb for CoSb 3 , 18 Mo for NbFeSb, 19 AgNi alloy for NbFeSb, 20 Co−P for Bi 2 Te 3 , 21 and TiB 2 −Si 3 N 4 alloy for SiGe. 22 CoSb 3 -based filled skutterudites are considered as one kind of the most promising mid-temperature TE materials not only due to their good TE performance but also due to their low cost, high mechanical strength, and high thermal stability.…”

Section: Introductionmentioning

confidence: 99%

“…Diffusion barrier layers between TE materials and electrodes are usually introduced to solve these interfacial problems. , A good diffusion barrier material for the TE joints generally needs to meet the following requirements: ,, matched coefficient of thermal expansion (CTE), high contact electrical and thermal conductivity, stabilized interdiffusion behaviors, high bonding strength, and excellent thermal and chemical stability. Therefore, metals and alloys are usually taken as diffusion barrier materials and electrodes for the TE joints, ,, such as Ni for SnSe and Zn 4 Sb 3 , Sn for GeTe, Au for Cu 26 Nb 2 Ge 6 S 32 , Cu for Mg 2 Si, Fe for GeTe and PbTe, Ti for Bi 2 Te 3 and CoSb 3 , Nb for CoSb 3 , Mo for NbFeSb, AgNi alloy for NbFeSb, Co–P for Bi 2 Te 3 , and TiB 2 –Si 3 N 4 alloy for SiGe …”

Section: Introductionmentioning

confidence: 99%

Enhanced Interfacial Reliability and Mechanical Strength of CoSb₃-Based Thermoelectric Joints with Rationally Designed Diffusion Barrier Materials of Ti-Based Alloys

Zhao

Chen

et al. 2020

ACS Appl. Mater. Interfaces

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To achieve high-performance thermoelectric (TE) devices, constructing a good interfacial connection between TE materials and electrodes is as important as having high figure-of-merit TE materials. Although CoSb 3 -based TE devices have received great attention for power generation recently, the limited long-term service stability is the main obstruct for their applications. In this work, we have prepared two kinds of Ti-based alloys (Ti 83.7 Al 10.7 Si 5.6 and Ti 74 Ni 26 ) as the diffusion barrier layer of CoSb 3 -based TE joints by the spark plasma sintering method and have systematically investigated their interfacial behaviors during the aging process. The performances of contact resistivity and mechanical strength for Ti 74 Ni 26 /Yb 0.4 Co 3.8 Fe 0.2 Sb 12 TE joints are good before aging treatment but gradually deteriorate during the aging process, which should be ascribed to the phase-transition-induced negative thermal expansion in Ti−Ni alloys. On the other hand, Ti 83.7 Al 10.7 Si 5.6 /Yb 0.4 Co 3.8 Fe 0.2 Sb 12 TE joints show both low contact resistivity (<10 μΩ•cm 2 ) and high mechanical strength (>20 MPa) before and after 16-day aging at 500 °C, which is originated from the matching of the coefficient of thermal expansion (CTE) and the formation of network structures in Ti−Al−Si alloys. We have also prepared an eight-couple TE module of p-Ge 0.9 Sb 0.1 TeB 0.01 /n-Yb 0.4 Co 3.8 Fe 0.2 Sb 12 and have measured its corresponding device performance. Our work has demonstrated that the matched CTE and network structures in the Ti−Al−Si alloy are key to obtain high-performance CoSb 3 -based TE joints for long-term service.

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Electrical characteristics and detailed interfacial structures of Ag/Ni metallization on polycrystalline thermoelectric SnSe

Cited by 18 publications

References 24 publications

Thermoelectric power generation: from new materials to devices

Thermoelectric power generation: from new materials to devices

Advanced Thermoelectric Design: From Materials and Structures to Devices

Enhanced Interfacial Reliability and Mechanical Strength of CoSb₃-Based Thermoelectric Joints with Rationally Designed Diffusion Barrier Materials of Ti-Based Alloys

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Electrical characteristics and detailed interfacial structures of Ag/Ni metallization on polycrystalline thermoelectric SnSe

Cited by 18 publications

References 24 publications

Thermoelectric power generation: from new materials to devices

Thermoelectric power generation: from new materials to devices

Advanced Thermoelectric Design: From Materials and Structures to Devices

Enhanced Interfacial Reliability and Mechanical Strength of CoSb3-Based Thermoelectric Joints with Rationally Designed Diffusion Barrier Materials of Ti-Based Alloys

Contact Info

Product

Resources

About

Enhanced Interfacial Reliability and Mechanical Strength of CoSb₃-Based Thermoelectric Joints with Rationally Designed Diffusion Barrier Materials of Ti-Based Alloys