1999
DOI: 10.1109/55.740656
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Electrical characteristics of an optically controlled N-channel AlGaAs/GaAs/InGaAs pseudomorphic HEMT

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Cited by 13 publications
(2 citation statements)
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“…Since a large conduction band discontinuity at an AlGaAs/InGaAs heterojunction interface produces high two-dimensional electron gas (2DEG) densities in an InGaAs channel, a pHEMT provides a very high electron mobility without inducing electrons scattering, resulting in a high-frequency performance. 11,12) In this study, we develop a phototransistor from a pHEMT with an AlGaAs/InGaAs dual heterojunction and an undoped GaAs graded buffer in an MMIC chip. This chip can be used as not only a highspeed transistor, but also an optoelectronic mixer for performing photodetection and frequency up-convertion simultaneously.…”
Section: Introductionmentioning
confidence: 99%
“…Since a large conduction band discontinuity at an AlGaAs/InGaAs heterojunction interface produces high two-dimensional electron gas (2DEG) densities in an InGaAs channel, a pHEMT provides a very high electron mobility without inducing electrons scattering, resulting in a high-frequency performance. 11,12) In this study, we develop a phototransistor from a pHEMT with an AlGaAs/InGaAs dual heterojunction and an undoped GaAs graded buffer in an MMIC chip. This chip can be used as not only a highspeed transistor, but also an optoelectronic mixer for performing photodetection and frequency up-convertion simultaneously.…”
Section: Introductionmentioning
confidence: 99%
“…The semiconductor consisted of doped nanoribbons of single crystalline silicon, transfer printed onto a carrier wafer coated with a bilayer of poly͑methyl methacrylate͒ ͑PMMA͒ ͑MicroChem, USA͒ and polyimide ͑PI͒ ͑Sigma Aldrich, USA͒ having thicknesses of 100 nm and 1.2 m. The CMOS inverters were fabricated by using procedures related to those reported recently. 2,3 Spin coating the resulting circuits with a PI layer ͑ϳ1.2 m͒ positioned the circuit layers near the neutral mechanical plane of the composite structure. Next, reactive ion etching through patterned etch masks removed regions of the PI encapsulant, substrate, and underlying PMMA layer, to isolate the interconnects, to define structural bridges and to create a periodic array of circular openings.…”
mentioning
confidence: 99%