2012 IEEE 38th Photovoltaic Specialists Conference (PVSC) PART 2 2012
DOI: 10.1109/pvsc-vol2.2012.6656756
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Electrical characterization of Cu composition effects in CdS/CdTe thin-film solar cells with a ZnTe:Cu back contact

Abstract: We study the effects of Cu composition on the CdTe/ZnTe:Cu back contact and the bulk CdTe. For the back contact, its potential barrier decreases with Cu concentration while its saturation current densit y increases. For the bulk CdTe, the hole densit y increases with Cu concentration. We identif y a Cu-related deep level at -0.55 eV whose concentration is significant when the Cu concentration is high. The device performance, which initially improves with Cu concentration then decreases, reflects the interpla y… Show more

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Cited by 5 publications
(5 citation statements)
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“…Hall measurements are often difficult to perform on p -type poly-CdTe films because of their low free-carrier concentrations and mobility. To probe the trap state behaviour in our material, admittance spectroscopy (AS) was carried out on completed poly-CdTe devices with comparable Cu concentrations 29 . Differential capacitance spectra as a function of temperature yield a hole trap activation energy of 152 meV, which is consistent with the acceptor-binding energy determined from the PL measurements.…”
Section: Resultsmentioning
confidence: 99%
“…Hall measurements are often difficult to perform on p -type poly-CdTe films because of their low free-carrier concentrations and mobility. To probe the trap state behaviour in our material, admittance spectroscopy (AS) was carried out on completed poly-CdTe devices with comparable Cu concentrations 29 . Differential capacitance spectra as a function of temperature yield a hole trap activation energy of 152 meV, which is consistent with the acceptor-binding energy determined from the PL measurements.…”
Section: Resultsmentioning
confidence: 99%
“…The observed concentration of the Cu i ++ defect corresponded well to the Cu diffusion profile monitored by secondary ion mass spectroscopy (SIMS) with a Cu piled up at the CdTe/CdS interface. 6,24 It is, therefore, possible that this deep defect level is originated from the Cu-containing back contact due to diffusion of excess Cu that was evaporated. Since sets of cell 1 samples had higher concentration of copper with 15 nm evaporated copper in addition to ZnTe:Cu (2 atomic% Cu) paste, possible formation copper-related defect (E V + 0.57 eV) can be inferred, where E v is the energy at valence band edge.…”
Section: Resultsmentioning
confidence: 99%
“…As most commonly practiced, ZnTe:Cu layers are deposited by sputtering at elevated temperature (240-360 ºC) in processes whose duration are on the order of hours [14,15]. The amount of copper is controlled by varying the composition of the sputter target or the layer thickness.…”
Section: Introductionmentioning
confidence: 99%
“…It is well known that copper is a fast diffuser, with reported coefficients of ~10 -9 cm 2 /s at the temperatures employed [16,17]. In addition to limiting throughput, another drawback of this procedure is that deposition and diffusion occur simultaneously, making process control difficult and resulting in copper migration throughout the device [15]. In bulk CdTe a very small amount of copper may be beneficial [18,19], however excessive amounts lead to deep level defects and recombination centers [20][21][22].…”
Section: Introductionmentioning
confidence: 99%