2010
DOI: 10.1109/tadvp.2009.2034536
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Electrical Characterization of Screen-Printed Circuits on the Fabric

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Cited by 140 publications
(23 citation statements)
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“…They are suitable for achieving large area (> 100 cm 2 ) planar circuits, or for concealing and localizing circuits within a small fabric space (< 10 cm 2 ) [26]. Additive manufacturing processes, such as inkjet printing [34], dispenser printing [35], and screen printing [36], have enabled electronic integration on textiles using electrically conductive inks. These inks contain conductive particles, and a polymer binder that holds the particles together [37].…”
Section: Materials and Fabrication Methodsmentioning
confidence: 99%
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“…They are suitable for achieving large area (> 100 cm 2 ) planar circuits, or for concealing and localizing circuits within a small fabric space (< 10 cm 2 ) [26]. Additive manufacturing processes, such as inkjet printing [34], dispenser printing [35], and screen printing [36], have enabled electronic integration on textiles using electrically conductive inks. These inks contain conductive particles, and a polymer binder that holds the particles together [37].…”
Section: Materials and Fabrication Methodsmentioning
confidence: 99%
“…These inks contain conductive particles, and a polymer binder that holds the particles together [37]. These conductive inks are implemented as interconnections [21], resistors [36], piezoresistive strain gauges [38] piezoelectric sensors [39]and electroluminescent displays [35]. Metal deposition methods, including metal plating, thermal evaporation, and sputtering have also been used to deposit metallic films on textiles [26].…”
Section: Materials and Fabrication Methodsmentioning
confidence: 99%
“…Regarding the first approach, two aspects need to be considered: the fabrication of the textile electrical circuits and their interconnection with external devices that can also be rigid. Different methods for the fabrication of electrical circuit have been reported in the literature: embroidering of conductive yarns [44,45], weaving [46,47] and knitting by using conductive and non-conductive yarns [48], laser cutting of conductive fabrics [49], screen printing [50], and use of plastic-based e-strips that can be woven like traditional yarns [51,52]. About the interconnection between the circuits and the external devices: soldering [49,51,52], gluing with conductive [46,52] and non-conductive adhesives [47], embroidering and stitching with conductive yarns [45,49], and crimping [53] are the most used techniques.…”
Section: Led Devicesmentioning
confidence: 99%
“…The fabric circuit was obtained by using a methodology that combines the "iron-on" technique and laser cutting; firstly, a heat-activated paper adhesive is attached to a conductive fabric, afterward, a laser cutter is used to etch the circuit pattern into the fabric and the paper is removed from underneath the circuit, finally, the circuit is ironed onto the second piece of fabric [44,49]. The highly scalable and low-cost screen-printing technique was exploited by Kim et al as a valid alternative to laser cutting, and the flip-chip method was employed to interconnect external electrical elements to the circuit [50]. The connection to the textile circuit can be also carried out by using a thermoplastic non-conductive adhesive [47,54]; by heat and pressure application the adhesive melts and electrical contact is formed.…”
Section: Led Devicesmentioning
confidence: 99%
“…Fiber composition has been reported to have an effect on the electrical properties of fabrics despite differences in structural properties, including yarn diameter and fabric density. Woven fabrics of cotton, viscose, silk, wool, and polyester had an electrical resistivity of 1.76 × 10 12 Ω/m, 3.62 × 10 11 Ω/m, 2.40 × 10 13 Ω/m, 2.30 × 10 13 Ω/m, and 4.35 × 10 13 Ω/m, respectively, at 35% relative humidity (RH) [114]. Structural properties also affect electrical properties, thus for such comparisons of fiber composition, all else should be the same except the property of interest.…”
Section: Fabrics—the Effect Of Fiber Composition and Fabric Structurementioning
confidence: 99%