Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

Shi, Frank G.; Abdullah, Mikrajuddin; Chungpaiboonpatana, S.; Okuyama, Kikuo; Davidson, C.L.; Adams, Judith

doi:10.1016/s1369-8001(99)00018-9

Cited by 52 publications

(50 citation statements)

References 9 publications

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“…Comparing the result with the ratio of ten obtained using other models (Yim and Paik 1998;Hu et al 1997;Shi et al 1999;Williams et al 1993), the proposed scheme predicts much more accurately. The main reason for the improvement is that the route of the gold bumps, which contributes most to the equivalent resistance, is taken into consideration.…”

Section: Resultsmentioning

confidence: 74%

“…The gap between the experiment and the prediction implies that except for the compressive load, there are some unmodeled properties that affect the contact resistance. Chin et al (2004) compared different models (Yim and Paik 1998;Hu et al 1997;Shi et al 1999;Williams et al 1993) used in estimating the contact resistance of anisotropic conductive adhesive assemblies. It was found that there are great inconsistencies among the current models and between the predicted contact resistances and the experimentally measured values.…”

Section: Introductionmentioning

confidence: 99%

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A novel contact resistance model of anisotropic conductive film for FPD packaging

Wang

Lin

2006

Microsyst Technol

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A novel contact resistance model for the flat panel display (FPD) packaging based on the within layer parallel and between layers series resistance concepts is proposed in this research. The FJ2530 anisotropic conductive films (ACF) by Sony Inc., containing the currently smallest 3 mu m conductive particles, was used to conduct experiments to verify the accuracy of the proposed model. The calculated chip-on-glass (COG) packaging resistance using the proposed model is 0.165 Omega. It is found that a gold bump with 0.162 Omega resistance play a major role in the overall resistance. Although the predicted resistance using the proposed model is only one third of the experimentally measured value a threefold improvement is obtained compared to existing models

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Section: Resultsmentioning

confidence: 74%

Section: Introductionmentioning

confidence: 99%

A novel contact resistance model of anisotropic conductive film for FPD packaging

Wang

Lin

2006

Microsyst Technol

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“…The factor   / plays similar role with  in the electric current flow. This similarity allows the adoption of equation that explains the effective conductivity in a conductive fillers/insulating matrix composite to be used for calculating the effective permeability of porous materials [16][17][18].…”

Section: Resultsmentioning

confidence: 99%

Fabrication of Microporous Water Filter Using Titanium Dioxide Particles, Silica Particles, and Polyethylene Glycol

Priatama¹,

Abdullah²,

Khairurrijal³

et al. 2010

itbj.eng.sci.

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Abstract. We report the fabrication of microporous filter for use in filtering both inorganic and organic substances from liquid materials. Titania (TiO 2 ) anatase was used as the main material for this filter. Polyethylene glycol (PEG) with average molecular weight of 20,000 was also used as additive to control the formation of pores, especially pore sizes. The mixture of titania and PEG was pressed into cylindrical tablet shape at room temperature and then simply heated inside a furnace up to temperature where the PEG decomposed into gas to leave only connected titania particles. The use of titania as base material for the filter allows the organic substances that trapped inside the filter pores to be easily removed by heating up the used filter at above decomposition temperature of the trapped organics. We also made other filter by adding small amount of silica (SiO 2 ) particles to reduce the size of the pores as well as to improve the mechanical strength. We observed that filters containing silica particles, with smaller in size compared to titania, resulted in better mechanical strength, smaller in pore sizes and better filtering results in term of turbidity and dissolved oxygen (DO) content. This method is potential for development of larger scale and cheaper water filters for use in various applications.

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“…Both resistances are functions of volume loading of metal particles. [18][19][20][21] However, the solvent and polymer resistances could not be disregarded as factors because they influence electrical resistance. For this reason, total electrical resistance for conductive adhesive was determined with the following formula:…”

Section: Resultsmentioning

confidence: 99%

Effect of Solvent Evaporation and Shrink on Conductivity of Conductive Adhesive

et al. 2005

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This paper describes the effect of solvent evaporation and shrink in conductive adhesive. The adhesion mechanism of conductive adhesive strongly depends on the curing of the polymer matrix. The curing is preceded by polymer matrix chemical reactions, such as cross-linking, solvent evaporation and shrink. Accordingly, it is important to understand the effect of solvent evaporation and conductive adhesive shrink in curing. The curing behaviors and solvent evaporation of conductive adhesive were investigated using a differential scanning calorimeter (DSC) and thermo gravimetric analysis (TGA). As curing time increases, the silver particles in the polymer are concentrated due to the incremental solvent evaporation rate and the shrink rate. As a result, the silver particles in the polymer form an electric path. These results reveal that the shrink rate and solvent evaporation rate increase in conductive adhesive during the curing process improved their conductivity.

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Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

Cited by 52 publications

References 9 publications

A novel contact resistance model of anisotropic conductive film for FPD packaging

A novel contact resistance model of anisotropic conductive film for FPD packaging

Fabrication of Microporous Water Filter Using Titanium Dioxide Particles, Silica Particles, and Polyethylene Glycol

Effect of Solvent Evaporation and Shrink on Conductivity of Conductive Adhesive

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