Electrical matching of low power piezoelectric ultrasonic transducers for microelectronic bonding

Zhang, Hongjie; Wang, Fujun; Tian, Yanling; Zhao, Xingyu; Zhang, Dawei; Han, Lin-Hai

doi:10.1016/j.sna.2013.05.028

Cited by 36 publications

(15 citation statements)

References 17 publications

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“…The mechanical arm is a series of RLC circuit that composes by a dynamic capacitance C1, a dynamic inductance L1 and a dynamic resistance R1. In general, both arms are connected in parallel and R0 has bigger value than other parallel components; therefore, it is assumed to be neglected [5][6]16].…”

Section: Related Theoriesmentioning

confidence: 99%

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Automatic Resonance-Frequency Tuning and Tracking Technique for a 1MHz Ultrasonic-Piezoelectric-Transducer Driving Circuit in Medical Therapeutic Applications Using dsPIC Microcontroller and PLL Techniques

Boontaklang¹,

Chompoo-inwai²

2019

IJIES

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Driving ultrasonic piezoelectric transducer (UPZT) at maximum performance in real-time operations is a very challenging task due to the deterioration problem of ultrasound output causing by human-skin impedance fluctuations. This paper proposed ideas and solutions on how to maximize the UPZT driving circuit performance in or deter to solve the deterioration problem. A newly-designed feedback control block with a phase-locked-loop (PLL) technique controlled by microcontroller has been added to the conventional UPZT driving circuit to ensure the automatic resonance frequency tuning and tracking capabilities. After intensive experiments, it is clear that the proposed technique works flawlessly and much more efficient compared to the conventional one. The experimental results also confirm that the percentage of error in tuning to the desired frequency is less than ±0.2% and the speed of tuning convergence time is between 9-12 milliseconds on average.

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Section: Related Theoriesmentioning

confidence: 99%

“…Ultrasound or ultrasonic wave has long been used in many industrial businesses [1][2][3][4][5][6][7] including the medical applications [8][9][10]. The key device to generate the ultrasound wave is called ultrasonic piezoelectric transducer (UPZT).…”

Section: Introductionmentioning

confidence: 99%

Automatic Resonance-Frequency Tuning and Tracking Technique for a 1MHz Ultrasonic-Piezoelectric-Transducer Driving Circuit in Medical Therapeutic Applications Using dsPIC Microcontroller and PLL Techniques

Boontaklang¹,

Chompoo-inwai²

2019

IJIES

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“…Recently with the rapid development of microelectronic industries, the demand for electronic products with high pin-count IC installations and high assembly density has been increasingly growing [1][2][3] . As an important cost-effective and flexible interconnecting technology for microdevice packaging, thermosonic wire bondinghas been widely used for themicroelectronic packaging of nearly any type of daily used electronic products [4] .…”

Section: Introductionmentioning

confidence: 99%

Development of a high speed and precision wire clamp with both position and force regulations

Liang

Wang

Tian

et al. 2017

Robotics and Computer-Integrated Manufacturing

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Development of a high speed and precision wire clamp with both position and force regulations. . Permanent WRAP URL:http://wrap.warwick.ac.uk/94028 Copyright and reuse:The Warwick Research Archive Portal (WRAP) makes this work by researchers of the University of Warwick available open access under the following conditions. Copyright © and all moral rights to the version of the paper presented here belong to the individual author(s) and/or other copyright owners. To the extent reasonable and practicable the material made available in WRAP has been checked for eligibility before being made available.Copies of full items can be used for personal research or study, educational, or not-for-profit purposes without prior permission or charge. Provided that the authors, title and full bibliographic details are credited, a hyperlink and/or URL is given for the original metadata page and the content is not changed in any way.

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“…As one of the crucial microelectronic products, integrated circuits (ICs) have penetrated virtually all aspects of daily life [1][2][3] . The demand for electronic products with high pin-count IC installations and high assembly density, such as scientific instruments, mobile phones, computers and cars, has been growing, which calls for high performance semiconductor interconnection technology between chips and packages 4,5 .…”

Section: Introductionmentioning

confidence: 99%

A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

Liang

Wang

Tian

et al. 2015

Review of Scientific Instruments

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Placid. (2015) A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging. Review of Scientific Instruments, 86 (4). 045106. Permanent WRAP url: http://wrap.warwick.ac.uk/76447 Copyright and reuse:The Warwick Research Archive Portal (WRAP) makes this work by researchers of the University of Warwick available open access under the following conditions. Copyright © and all moral rights to the version of the paper presented here belong to the individual author(s) and/or other copyright owners. To the extent reasonable and practicable the material made available in WRAP has been checked for eligibility before being made available.Copies of full items can be used for personal research or study, educational, or not-for profit purposes without prior permission or charge. Provided that the authors, title and full bibliographic details are credited, a hyperlink and/or URL is given for the original metadata page and the content is not changed in any way. Publisher's statement:Copyright ( A note on versions:The version presented here may differ from the published version or, version of record, if you wish to cite this item you are advised to consult the publisher's version. Please see the 'permanent WRAP url' above for details on accessing the published version and note that access may require a subscription.A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging A novel monolithic piezoelectric actuated wire clamp is presented in this paper to achieve fast, accurate and robust microelectronic device packaging. The wire clamp has compact flexure-based mechanical structure and light weight. To obtain large and robust jaw displacements and ensure parallel jaw grasping, a two-stage amplification composed of a homothetic bridge type mechanism and parallelogram leverage mechanism was designed. Pseudo-rigid-body model (PRBM) and Lagrange approaches were employed to conduct the kinematic, static and dynamic modeling of the wire clamp, and optimization design was carried out. The displacement amplification ratio, maximum allowable stress and natural frequency were calculated. Finite element analysis (FEA) was conducted to evaluate the characteristics of the wire clamp and wire Electro Discharge Machining (EDM) technique was utilized to fabricate the monolithic structure. Experimental tests were carried out to investigate the performance, and the experimental results match well with the theoretical calculation and FEA.The amplification ratio of the clamp is 20.96, and the working mode frequency is 895 Hz.Step response test show the wire clamp has fast response and high accuracy, and the motion resolution is 0.2μm. High speed precision grasping operations of gold and copper wires were realized using the wire clamper.

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Electrical matching of low power piezoelectric ultrasonic transducers for microelectronic bonding

Cited by 36 publications

References 17 publications

Automatic Resonance-Frequency Tuning and Tracking Technique for a 1MHz Ultrasonic-Piezoelectric-Transducer Driving Circuit in Medical Therapeutic Applications Using dsPIC Microcontroller and PLL Techniques

Automatic Resonance-Frequency Tuning and Tracking Technique for a 1MHz Ultrasonic-Piezoelectric-Transducer Driving Circuit in Medical Therapeutic Applications Using dsPIC Microcontroller and PLL Techniques

Development of a high speed and precision wire clamp with both position and force regulations

A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

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